EP3C16U256C8
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 168 516096 15408 256-LFBGA |
|---|---|
| Quantity | 945 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-UBGA (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 168 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 963 | Number of Logic Elements/Cells | 15408 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 516096 |
Overview of EP3C16U256C8 – Cyclone® III Field Programmable Gate Array (FPGA), 256-LFBGA
The EP3C16U256C8 is a Cyclone III family FPGA offering a low-power, high-functionality programmable fabric for cost-sensitive, high-volume applications. This device provides 15,408 logic elements, approximately 0.5 Mbits of embedded memory (516,096 bits), and 168 user I/Os in a compact 256-ball LFBGA package.
Designed for commercial-temperature systems, the device operates from a 1.15 V to 1.25 V core supply and is intended for surface-mount assembly. Cyclone III family characteristics emphasize low power, flexible I/O standards, and integrated clock management to simplify system design and reduce power budgets.
Key Features
- Programmable Logic Capacity 15,408 logic elements for implementing mid-range combinational and sequential logic designs.
- Embedded Memory 516,096 bits of on-chip RAM (approximately 0.5 Mbits) to support buffering, FIFOs, and local data storage without external SRAM.
- I/O Count and Flexibility 168 user I/Os suitable for diverse interfaces and peripherals; adjustable I/O slew rates and support for multiple I/O standards are provided at the family level.
- Clock Management Family-level support includes multiple PLLs for clock synthesis and distribution to manage system and I/O timing.
- Low-Power Operation Built on a low-power process and silicon optimizations from the Cyclone III family to reduce static power consumption for battery-powered or thermally constrained designs.
- Package and Assembly 256-ball LFBGA surface-mount package (supplier package: 256-UBGA, 14×14) for compact PCB integration.
- Commercial Temperature Grade Rated for 0 °C to 85 °C operation, suited to commercial applications and environments.
- Compliance RoHS compliant.
Typical Applications
- Portable and Handheld Devices Low-power characteristics and on-chip memory make the device suitable for battery-powered consumer products where energy efficiency is important.
- Consumer Electronics Use as a system controller, display or I/O bridge, or peripheral interface to consolidate functions and reduce BOM count.
- Communications and Networking Endpoints Mid-range logic density and flexible I/O enable protocol handling, buffering, and interface adaptation at the network edge.
- Embedded Control and Processing Supports soft-processor implementations and custom hardware accelerators for machine control, protocol offload, or system management tasks.
Unique Advantages
- Well-balanced Logic and Memory: 15,408 logic elements paired with approximately 0.5 Mbits of embedded RAM supports common mid-range FPGA functions without immediate need for external memory.
- Compact, Surface-Mount Package: 256-LFBGA (256-UBGA, 14×14) provides a small footprint for space-constrained PCBs while retaining a high I/O count.
- Low-Voltage Core: 1.15 V to 1.25 V supply range aligns with modern low-power system designs and helps reduce overall system power.
- Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for broad commercial deployments.
- Family-Level System Features: Cyclone III family capabilities such as multiple PLLs, flexible I/O standards, and low-power process advantages support efficient system integration and clocking strategies.
Why Choose EP3C16U256C8?
The EP3C16U256C8 balances mid-range logic capacity, embedded memory, and a high I/O count in a compact LFBGA package, making it a strong choice for commercial applications that require programmable logic with low power consumption. Its commercial temperature rating and surface-mount package simplify integration into consumer and portable systems.
For designers seeking a cost-sensitive FPGA with family-level low-power and clock-management features, this Cyclone III device offers a practical platform to implement control logic, interface bridging, and embedded processing functions while keeping BOM and board area under control.
Request a quote or contact sales for pricing, availability, and board-level support options for the EP3C16U256C8.

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