EP3C16U256C8

IC FPGA 168 I/O 256UBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 168 516096 15408 256-LFBGA

Quantity 945 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package256-UBGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGANumber of I/O168Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs963Number of Logic Elements/Cells15408
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits516096

Overview of EP3C16U256C8 – Cyclone® III Field Programmable Gate Array (FPGA), 256-LFBGA

The EP3C16U256C8 is a Cyclone III family FPGA offering a low-power, high-functionality programmable fabric for cost-sensitive, high-volume applications. This device provides 15,408 logic elements, approximately 0.5 Mbits of embedded memory (516,096 bits), and 168 user I/Os in a compact 256-ball LFBGA package.

Designed for commercial-temperature systems, the device operates from a 1.15 V to 1.25 V core supply and is intended for surface-mount assembly. Cyclone III family characteristics emphasize low power, flexible I/O standards, and integrated clock management to simplify system design and reduce power budgets.

Key Features

  • Programmable Logic Capacity  15,408 logic elements for implementing mid-range combinational and sequential logic designs.
  • Embedded Memory  516,096 bits of on-chip RAM (approximately 0.5 Mbits) to support buffering, FIFOs, and local data storage without external SRAM.
  • I/O Count and Flexibility  168 user I/Os suitable for diverse interfaces and peripherals; adjustable I/O slew rates and support for multiple I/O standards are provided at the family level.
  • Clock Management  Family-level support includes multiple PLLs for clock synthesis and distribution to manage system and I/O timing.
  • Low-Power Operation  Built on a low-power process and silicon optimizations from the Cyclone III family to reduce static power consumption for battery-powered or thermally constrained designs.
  • Package and Assembly  256-ball LFBGA surface-mount package (supplier package: 256-UBGA, 14×14) for compact PCB integration.
  • Commercial Temperature Grade  Rated for 0 °C to 85 °C operation, suited to commercial applications and environments.
  • Compliance  RoHS compliant.

Typical Applications

  • Portable and Handheld Devices  Low-power characteristics and on-chip memory make the device suitable for battery-powered consumer products where energy efficiency is important.
  • Consumer Electronics  Use as a system controller, display or I/O bridge, or peripheral interface to consolidate functions and reduce BOM count.
  • Communications and Networking Endpoints  Mid-range logic density and flexible I/O enable protocol handling, buffering, and interface adaptation at the network edge.
  • Embedded Control and Processing  Supports soft-processor implementations and custom hardware accelerators for machine control, protocol offload, or system management tasks.

Unique Advantages

  • Well-balanced Logic and Memory: 15,408 logic elements paired with approximately 0.5 Mbits of embedded RAM supports common mid-range FPGA functions without immediate need for external memory.
  • Compact, Surface-Mount Package: 256-LFBGA (256-UBGA, 14×14) provides a small footprint for space-constrained PCBs while retaining a high I/O count.
  • Low-Voltage Core: 1.15 V to 1.25 V supply range aligns with modern low-power system designs and helps reduce overall system power.
  • Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for broad commercial deployments.
  • Family-Level System Features: Cyclone III family capabilities such as multiple PLLs, flexible I/O standards, and low-power process advantages support efficient system integration and clocking strategies.

Why Choose EP3C16U256C8?

The EP3C16U256C8 balances mid-range logic capacity, embedded memory, and a high I/O count in a compact LFBGA package, making it a strong choice for commercial applications that require programmable logic with low power consumption. Its commercial temperature rating and surface-mount package simplify integration into consumer and portable systems.

For designers seeking a cost-sensitive FPGA with family-level low-power and clock-management features, this Cyclone III device offers a practical platform to implement control logic, interface bridging, and embedded processing functions while keeping BOM and board area under control.

Request a quote or contact sales for pricing, availability, and board-level support options for the EP3C16U256C8.

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