EP3C16U484A7N

The EP3C16U484A7N is a Cyclone® III field programmable gate array (FPGA) in a 484‑FBGA package designed for low-power, high-functionality embedded logic. It provides 15,408 logic elements, approximately 0.5 Mbits of on-chip RAM and up to 346 I/Os, making it suitable for applications that require significant I/O density, efficient on‑chip memory and configurable logic in a compact surface‑mount package.

Qualified to AEC‑Q100 and specified for an operating range of −40 °C to 125 °C with a core supply of 1.15 V to 1.25 V, this device targets designs that demand reliable operation across broad temperature and automotive-grade qualification environments.

Key Features

• Logic Capacity  15,408 logic elements provide substantial programmable logic for medium-density designs and custom hardware acceleration.
• Embedded Memory  Approximately 0.5 Mbits of on‑chip RAM for buffering, FIFOs and small data stores without external memory.
• I/O Density  Up to 346 I/O pins enable high connectivity for sensor arrays, parallel interfaces and mixed-signal front ends.
• Power and Supply  Core voltage range of 1.15 V to 1.25 V supports low‑power operation consistent with Cyclone III low‑power process characteristics.
• Package and Mounting  484‑FBGA (supplier designation 484‑UBGA, 19×19) surface‑mount package for compact PCB implementations.
• Automotive Qualification  AEC‑Q100 qualification and an operating temperature range of −40 °C to 125 °C for designs requiring automotive‑grade reliability.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.
• Family Architecture  Based on the Cyclone III device family, which emphasizes low static power and system integration features such as multiple PLLs and flexible I/O support (as described in the Cyclone III device documentation).

Typical Applications

• Automotive Electronics  Use in vehicle subsystems where AEC‑Q100 qualification and extended temperature range are required for reliable operation.
• Industrial Control  I/O‑rich embedded controllers and motor control interfaces that benefit from dense programmable logic and on‑chip memory.
• Communications and Interfaces  Protocol bridging, parallel data aggregation and custom interface logic leveraging the high I/O count and embedded RAM.
• Embedded Processing  Custom accelerator blocks and glue logic in compact systems where surface‑mount, FBGA packaging is preferred.

Unique Advantages

• Automotive‑grade qualification: AEC‑Q100 status and a −40 °C to 125 °C operating range support deployment in temperature‑challenging and automotive environments.
• Balanced logic and memory: 15,408 logic elements paired with approximately 0.5 Mbits of embedded RAM simplify designs that need on‑chip buffering without external memory.
• High I/O count: 346 I/Os allow direct connection to multiple peripherals and sensor arrays, reducing the need for external multiplexing.
• Compact package: 484‑FBGA (19×19 UBGA) enables a dense board footprint while maintaining robust soldered connections for surface‑mount assembly.
• Low‑power architecture: As part of the Cyclone III family, the device benefits from low‑power process and family-level optimizations for reduced static power in volume applications.
• Standards and ecosystem: Family documentation describes broad I/O standard support and clock management resources that aid system integration and reduce development cycles.

Why Choose EP3C16U484A7N?

The EP3C16U484A7N combines a substantial logic element count, meaningful on‑chip memory and a very high I/O density in a compact 484‑FBGA package, making it a strong choice for medium-density, I/O‑intensive designs that require automotive qualification and extended temperature operation. Its Cyclone III family heritage emphasizes low power and system integration features useful for embedded and automotive applications.

This device is well suited for designers seeking a qualified, reliable FPGA with a balance of logic, memory and peripheral connectivity that streamlines BOM and board complexity while supporting long‑term deployment in demanding environments.

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