EP3C16U256C8N

The EP3C16U256C8N is a Cyclone® III family field programmable gate array (FPGA) in a 256-LFBGA package, designed for low-power, cost-sensitive applications. It integrates approximately 15,408 logic elements and approximately 516,096 bits of on-chip RAM to support mid-range logic and memory requirements while offering a broad set of I/O and system-level resources.

Targeted at commercial-grade applications, this device provides a balance of integration, power efficiency, and flexible I/O for embedded systems, interface bridging, and mid-density programmable logic tasks.

Key Features

• Logic Capacity — Approximately 15,408 logic elements organized across 963 LABs to implement combinational and sequential logic functions.
• Embedded Memory — Approximately 516,096 bits (~0.5 Mbits) of on-chip RAM for buffering, packet storage, and state retention.
• I/O Resources — 168 user I/Os to support multiple interfaces and parallel connections for system-level integration.
• Clock Management — Cyclone III family features such as multiple PLLs provide flexible clock synthesis and distribution for system timing needs.
• Power Supply — Operates from a core supply range of 1.15 V to 1.25 V to meet device core requirements.
• Package & Mounting — 256-LFBGA package (supplier device package: 256-UBGA, 14×14) with surface-mount mounting for compact PCB designs.
• Commercial Grade & Temperature Range — Commercial-grade device rated for 0 °C to 85 °C operation.
• RoHS Compliance — Conforms to RoHS requirements for lead-free assembly and regulatory alignment.

Typical Applications

• Embedded Control — Use as a mid-density FPGA for control logic, state machines, and glue logic in embedded platforms where moderate logic and memory capacity are required.
• Interface Bridging — Implement protocol conversion and custom interfacing between subsystems leveraging 168 available I/Os and clock management resources.
• Consumer and Industrial Electronics — Suitable for commercial-grade consumer or industrial products that require low-power programmable logic and on-chip RAM for buffering or preprocessing.
• Prototyping and Proof-of-Concept — Well suited for designers validating mid-range designs that need reprogrammability and on-board resources without high-density FPGA complexity.

Unique Advantages

• Balanced Logic and Memory: Approximately 15,408 logic elements paired with ~0.5 Mbits of embedded RAM provide headroom for mid-range logic functions and data buffering without external memory.
• Flexible I/O Count: 168 I/Os enable direct connection to multiple peripherals and buses, reducing the need for external I/O expansion.
• Compact Packaging: 256-LFBGA (14×14 UBGA) surface-mount package supports compact PCB layouts for space-constrained designs.
• Commercial Temperature Rating: Qualified for 0 °C to 85 °C operation to match typical commercial application environments.
• Regulatory Compliance: RoHS-compliant construction supports lead-free manufacturing and regulatory requirements.

Why Choose EP3C16U256C8N?

The EP3C16U256C8N offers a pragmatic mix of logic capacity, embedded memory, and I/O density in a compact surface-mount package for commercial applications. Its Cyclone III family heritage emphasizes low-power operation and system integration, making this device a suitable choice for projects that require reprogrammability, intermediate logic density, and reliable performance within a commercial temperature range.

For teams seeking a mid-density FPGA that streamlines board design and reduces external component count, the EP3C16U256C8N delivers verifiable on-chip resources and regulatory compliance to support production-ready designs.

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