EP3C16U484C6

IC FPGA 346 I/O 484UBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 346 516096 15408 484-FBGA

Quantity 326 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package484-UBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-FBGANumber of I/O346Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs963Number of Logic Elements/Cells15408
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits516096

Overview of EP3C16U484C6 – Cyclone® III Field Programmable Gate Array (FPGA) IC 346 516096 15408 484-FBGA

The EP3C16U484C6 is a Cyclone® III family FPGA optimized for low-power, cost-sensitive designs that require mid-range logic capacity and high I/O density. It integrates 15,408 logic elements across 963 LABs, approximately 0.5 Mbits of embedded memory, and 346 user I/Os in a 484-FBGA (484-UBGA, 19×19) package.

Designed for commercial applications, this device operates from 1.15 V to 1.25 V and across a 0 °C to 85 °C ambient temperature range, delivering an integrated platform for battery-powered, portable, and space-constrained systems.

Key Features

  • Logic Capacity – 15,408 logic elements arranged across 963 LABs to implement mid-range FPGA designs and custom digital blocks.
  • Embedded Memory – Approximately 0.5 Mbits of on-chip RAM for buffering, FIFOs, and small data storage needs without external memory.
  • I/O Density & Package – 346 user I/Os in a 484-FBGA (484-UBGA, 19×19) package to support dense peripheral and high-pin-count interfaces.
  • Low-Voltage Core – Core supply range of 1.15 V to 1.25 V to support low-power operation and optimized power budgets.
  • Commercial Temperature Grade – Rated for operation from 0 °C to 85 °C for mainstream electronic products.
  • Clocking and Timing – Family-level clock management features including up to four phase-locked loops (PLLs) with multiple outputs for flexible clock synthesis and distribution.
  • I/O Standards and Signal Integrity – Supports a broad selection of I/O standards and adjustable slew rates to improve signal integrity and interface compatibility.
  • RoHS Compliant – Meets RoHS requirements for lead-free manufacturing and environmental compliance.

Typical Applications

  • Portable and Handheld Devices – Low-voltage operation and family-level low-power optimizations make the device suitable for battery-powered designs where extended runtime matters.
  • Consumer and Communications – High I/O count and flexible I/O standards support user interfaces, bridging logic, and peripheral connectivity in consumer electronics and communications equipment.
  • Embedded Control and Processing – Mid-range logic capacity and on-chip RAM enable customized control, DSP front-ends, and lightweight embedded processing functions.
  • System Integration – Dense I/O and embedded memory allow consolidation of glue logic, protocol handling, and peripheral aggregation to reduce BOM and PCB complexity.

Unique Advantages

  • Balanced Mid-Range Capacity: 15,408 logic elements provide the right density for moderate-complexity designs without excess cost or power.
  • High I/O Integration: 346 user I/Os in a compact 484-FBGA package simplify board routing and enable multiple external interfaces.
  • Compact Embedded Memory: Approximately 0.5 Mbits of on-chip RAM reduces reliance on external memory for buffering and state storage.
  • Power-Aware Design: Narrow core voltage range and Cyclone III family low-power characteristics help manage system power and thermal budgets.
  • Commercial Temperature Fit: 0 °C to 85 °C rating aligns with mainstream electronics and consumer product requirements.
  • Standards and Clock Flexibility: Support for multiple I/O standards and integrated PLLs assists in building robust interfaces and precise clocking solutions.

Why Choose EP3C16U484C6?

The EP3C16U484C6 delivers a focused combination of mid-range logic capacity, substantial I/O resources, and embedded memory in a compact 484-FBGA footprint. It is well suited to engineers who need to consolidate peripheral logic, implement custom interfaces, or add moderate embedded processing while keeping power and cost under control.

Backed by Cyclone III family architecture and features for low-power operation, flexible clock management, and broad I/O support, this device provides a practical, scalable platform for commercial applications where integration, power efficiency, and predictable thermal behavior are priorities.

Request a quote or submit a purchase inquiry to evaluate EP3C16U484C6 for your next design project.

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