EP3C16U256I7

The EP3C16U256I7 is an Intel Cyclone III field‑programmable gate array delivered in a 256‑LFBGA surface‑mount package. As a member of the Cyclone III family, it combines a low‑power silicon foundation with a feature set tailored for cost‑sensitive, high‑integration applications in industrial environments.

With 15,408 logic elements, approximately 0.52 Mbits of embedded memory, and 168 user I/Os, this device addresses mid‑range FPGA requirements where efficient logic, on‑chip memory and flexible I/O are central to the design.

Key Features

• Core Logic  15,408 logic elements provide mid‑range programmable logic capacity for glue logic, datapath acceleration, and control functions.
• Embedded Memory  Approximately 0.52 Mbits of on‑chip RAM for buffering, FIFOs, and small embedded data stores.
• I/O Capacity  168 I/O pins support a broad set of external interfaces and enable high pin‑count connectivity in constrained PCB layouts.
• Power and Voltage  Operates from a core supply range of 1.15 V to 1.25 V, consistent with low‑power Cyclone III family characteristics.
• Package and Mounting  256‑LFBGA (256‑UBGA, 14×14) surface‑mount package for compact board integration.
• Industrial Temperature Range  Rated for −40 °C to 100 °C operation to meet industrial deployment environments.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.
• Cyclone III Family Benefits  Built on a low‑power TSMC process with device‑level optimizations for reduced static power—suitable where power budget and cost are key considerations.

Typical Applications

• Industrial Control  Use for I/O‑intensive control systems and sensor interfaces where the industrial temperature rating and flexible I/O support robust field operation.
• Portable and Handheld Devices  Low‑power Cyclone III family characteristics help extend battery life for portable and handheld equipment.
• Communications and Protocol Bridging  High I/O count and on‑chip memory make the device suitable for protocol conversion, interface logic, and mid‑range communication endpoints.
• Embedded Processing Acceleration  Logic capacity and embedded RAM allow offloading of application‑specific datapaths and custom peripherals in compact systems.

Unique Advantages

• Balanced Mid‑Range Capacity: 15,408 logic elements and ~0.52 Mbits of embedded memory provide a practical balance of resources for many system designs without excessive cost or board area.
• Strong I/O Density: 168 user I/Os enable flexible external connectivity and support for multiple parallel interfaces or expanded peripheral sets.
• Industrial Reliability: Rated for −40 °C to 100 °C operation, suitable for deployed equipment in challenging temperature environments.
• Compact, Surface‑Mount Package: 256‑LFBGA (14×14 UBGA) reduces PCB footprint while maintaining a high pin count for dense board layouts.
• Low‑Power Silicon Foundation: Based on the Cyclone III low‑power family architecture, helping designs meet tight power budgets.
• RoHS Compliance: Environmentally compliant manufacturing simplifies regulatory acceptance for many markets.

Why Choose EP3C16U256I7?

The EP3C16U256I7 positions itself as a practical, cost‑aware Cyclone III FPGA for mid‑range applications that require a mix of logic density, embedded memory, and substantial I/O in an industrial‑rated package. Its low‑power family heritage and compact 256‑LFBGA footprint make it well suited to designs where board area, power consumption, and operating temperature range are key constraints.

Engineers and procurement professionals seeking a reliable, RoHS‑compliant FPGA with predictable resource counts and industrial temperature capability will find the EP3C16U256I7 a compelling option for system control, interface, and embedded acceleration tasks.

Request a quote for EP3C16U256I7 to check availability and pricing for your next design.