EP3C16U256I7N

The EP3C16U256I7N is a Cyclone III family FPGA in a 256-LFBGA package designed for industrial applications that require moderate logic capacity, on-chip memory and a high I/O count. It combines 15,408 logic elements and approximately 0.5 Mbits of embedded RAM with a 168-pin I/O interface in a surface-mount 14×14 256-UBGA footprint.

As part of the Cyclone III device family, the device benefits from the family’s low-power process optimizations and architecture intended for cost- and power-sensitive designs, while offering an industrial operating range for temperature-challenged environments.

Key Features

• Logic Capacity  15,408 logic elements provide the programmable fabric for custom control, data-path and glue-logic implementations.
• Embedded Memory  Approximately 0.5 Mbits (516,096 bits) of on-chip RAM to support buffering, state storage and small data structures without external memory.
• I/O Density  168 user I/O pins to support multiple interfaces, peripherals and board-level interconnects.
• Core Voltage  Nominal core supply range of 1.15 V to 1.25 V for core power planning and regulator selection.
• Package & Mounting  256-LFBGA (supplier package: 256-UBGA, 14×14) in a surface-mount package suitable for compact PCB integration.
• Industrial Temperature  Rated for operation from −40 °C to 100 °C, suitable for industrial and temperature-challenging deployments.
• RoHS Compliant  Meets RoHS requirements for lead-free manufacturing and regulatory compliance.
• Cyclone III Family Advantages  Built on the Cyclone III device family, which emphasizes low power operation and a feature set targeting high integration and cost-sensitive designs.

Typical Applications

• Industrial Control  Leverage industrial temperature rating and on-chip logic/memory for motion control, PLC glue logic and factory automation interfaces.
• Embedded Systems  Use the 15,408 logic elements and embedded RAM for custom peripherals, protocol handling, and compact system-on-board designs.
• Interface Bridging  High I/O count (168 pins) enables board-level bridging between sensors, buses and host processors without large external glue logic.
• Communications & Instrumentation  Implement protocol adaptation, timing-critical logic and buffering tasks where moderate logic density and deterministic behavior are required.

Unique Advantages

• Balanced Logic and Memory:  15,408 logic elements paired with ~0.5 Mbits of embedded RAM support control-heavy designs with on-chip data storage.
• High I/O Capacity:  168 I/Os reduce the need for external expansion ICs and simplify board routing for multi-peripheral systems.
• Industrial Robustness:  −40 °C to 100 °C operating range helps ensure reliable operation in industrial and harsh environments.
• Compact, Surface-Mount Package:  256-LFBGA (14×14 UBGA) enables dense PCB layouts and small form-factor implementations.
• Regulatory-Friendly:  RoHS compliance supports lead-free manufacturing flows and simplifies environmental compliance.
• Family-Level Power Efficiency:  As a Cyclone III device, it benefits from the family’s low-power design focus for cost- and power-sensitive applications.

Why Choose EP3C16U256I7N?

The EP3C16U256I7N delivers a practical balance of programmable logic, on-chip memory and I/O density in a compact industrial-grade package. Its core voltage range, surface-mount 256-LFBGA footprint and RoHS compliance make it suitable for volume production designs that require a rugged, integration-friendly FPGA from the Cyclone III family.

This device is well-suited to engineers and procurement teams targeting embedded control, interface consolidation and industrial electronics projects that need a verified FPGA platform with predictable thermal and power parameters.

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