EP3C16U484C7

The EP3C16U484C7 is a Cyclone III family FPGA offering 15,408 logic elements, approximately 0.52 Mbits of embedded memory (516,096 total RAM bits) and 346 user I/O pins in a 484-ball FBGA (484-UBGA, 19×19) surface-mount package. The device operates from a 1.15 V to 1.25 V core supply and is specified for commercial temperature operation (0 °C to 85 °C).

As part of the Cyclone III device family, this FPGA leverages low-power process technology and silicon optimizations to address high-volume, low-power, cost-sensitive designs while providing a robust set of system-level features found across the family.

Key Features

• Logic Capacity  15,408 logic elements for building custom digital functions, state machines and glue logic.
• Embedded Memory  516,096 total RAM bits—approximately 0.52 Mbits of on-chip RAM to support FIFOs, buffers and local storage.
• I/O Density  346 user I/O pins to support multiple external interfaces and signal domains.
• Power  Core supply range of 1.15 V to 1.25 V consistent with low-power Cyclone III family operation.
• Package & Mounting  484-FBGA (484-UBGA, 19×19) surface-mount package for compact board implementations.
• Temperature & Grade  Commercial grade device rated for 0 °C to 85 °C operation.
• RoHS Compliance  RoHS compliant for lead‑free manufacturing requirements.
• Cyclone III Family Capabilities  Family-level features include low-power process technology, silicon and software power optimizations, and on-device system resources typical of Cyclone III devices.

Typical Applications

• Portable and handheld devices  Low-power family characteristics and compact FBGA packaging suit battery-powered consumer or handheld systems requiring programmable logic.
• Consumer electronics  High I/O count and on-chip RAM enable interface consolidation and local buffering in cost-sensitive, high-volume products.
• Interface bridging and protocol conversion  Abundant user I/Os and programmable logic density make the device suitable for glue-logic, protocol adapters and signal translation tasks.
• Embedded control and user interfaces  On-chip memory and logic resources support custom control, display driving and responsive user-interface implementations.

Unique Advantages

• Highly integrated programmable logic: 15,408 logic elements and embedded RAM reduce external component count and simplify BOM.
• Rich I/O capability: 346 I/O pins provide flexibility to connect sensors, peripherals and high-pin-count interfaces without additional multiplexing hardware.
• Compact, board-friendly package: 484-FBGA (19×19) surface-mount package minimizes PCB footprint for space-constrained designs.
• Low-voltage operation: 1.15 V to 1.25 V core supply aligns with low-power design targets characteristic of the Cyclone III family.
• Commercial temperature rating: Specified 0 °C to 85 °C operation for typical commercial deployments.
• Regulatory readiness: RoHS compliance supports lead-free manufacturing workflows.

Why Choose EP3C16U484C7?

The EP3C16U484C7 delivers a balanced combination of programmable logic capacity, on-chip memory and generous I/O in a compact FBGA package, tailored for high-volume, cost- and power-sensitive designs. Its specifications align with applications that require moderate logic density, substantial interface connectivity and compact board integration under commercial temperature conditions.

Choosing this Cyclone III family device provides access to a proven low-power FPGA platform and the ecosystem-level features associated with Cyclone III devices, enabling scalable design options and straightforward integration into systems that prioritize efficiency and footprint.

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