EP3C16U484C8N

The EP3C16U484C8N is a Cyclone® III field-programmable gate array (FPGA) in a 484-FBGA (19×19 UBGA) surface-mount package. It provides 963 LABs yielding 15,408 logic elements, approximately 0.5 Mbits (516,096 bits) of embedded RAM, and 346 user I/O pins for mid-range, I/O‑rich designs.

Built on the Cyclone III device family architecture, this device targets cost- and power-sensitive commercial applications that require a balance of logic density, on-chip memory, and high I/O count while operating within a 1.15 V–1.25 V supply range and a 0 °C to 85 °C commercial temperature window.

Key Features

• Core and Logic  963 LABs providing 15,408 logic elements for implementing custom digital logic, control, and signal-processing functions.
• Embedded Memory  Approximately 0.5 Mbits (516,096 bits) of on-chip RAM for buffering, FIFO storage, and small data tables without external memory.
• I/O Capacity  346 user I/Os delivered from the 484-FBGA package to support dense peripheral interfacing and multi-channel I/O configurations.
• Low-Power Family Architecture  Based on the Cyclone III low-power device family, designed for reduced static power consumption suitable for cost- and power-constrained products.
• Power Supply  Operates from a 1.15 V to 1.25 V core supply, enabling integration into tightly-specified power domains.
• Package & Mounting  484-FBGA (supplier package: 484-UBGA 19×19) surface-mount package for compact board-level integration.
• Commercial Temperature Grade  Specified for operation from 0 °C to 85 °C for standard commercial product deployments.
• Environmental Compliance  RoHS compliant, supporting lead‑free manufacturing processes.

Typical Applications

• Consumer and Portable Electronics  Low-power architecture and moderate logic density make the device suitable for battery-aware designs that require programmable control and signal handling.
• Communications Interfaces  High I/O count supports multi-channel I/O and protocol bridging where numerous external interfaces must be routed to a single FPGA.
• Embedded Control and Motor Control  On-chip logic and RAM enable compact implementations of control state machines, PWM generation, and local buffering without heavy external components.
• Prototyping and System Integration  Mid-range capacity and a compact FBGA package allow rapid iteration and integration into proof-of-concept and production hardware targeting cost-sensitive markets.

Unique Advantages

• Balanced Logic and Memory:  15,408 logic elements paired with approximately 0.5 Mbits of embedded RAM lets you implement both control logic and local data buffering on-chip, reducing external BOM.
• High I/O Density:  346 I/Os from a 484-FBGA package provide the connectivity needed for multi-interface designs without requiring larger packages.
• Low-Power Family Design:  Cyclone III family heritage emphasizes low static power, helping reduce system power draw in commercial applications.
• Compact Surface-Mount Package:  484-UBGA (19×19) packaging enables dense PCB layouts and small form-factor systems while preserving routing flexibility.
• Commercial Temperature and RoHS Compliant:  Specified 0 °C to 85 °C operation and RoHS compliance support standard commercial manufacturing and deployment requirements.

Why Choose EP3C16U484C8N?

The EP3C16U484C8N delivers a pragmatic combination of mid-range logic resources, embedded memory, and a high I/O count in a compact 484-FBGA package. It fits designs that require flexible programmable logic, on-chip buffering, and robust I/O capability while keeping power and board area under control.

This device is well suited to commercial product developers and OEMs who need a scalable, low-power FPGA option within the Cyclone III family, offering a balance of integration and standard temperature and environmental compliance for reliable deployment.

Request a quote or submit an inquiry to check availability and pricing for the EP3C16U484C8N or to discuss how it fits into your next design.