EP3C16U484I7N

The EP3C16U484I7N is a Cyclone III family field-programmable gate array (FPGA) in a 484‑FBGA package, delivered as an industrial-grade surface-mount device. It combines a mid-range logic capacity with on-chip memory and high I/O count for embedded and industrial applications that require integration, configurable logic and low-power operation.

Built on the Cyclone III device family architecture, this device targets cost- and power-sensitive designs while providing the interface flexibility and clock-management features expected from the family-level device handbook.

Key Features

• Core Density – 15,408 logic elements provide programmable logic capacity for glue logic, protocol bridging, and custom datapath implementation.
• Embedded Memory – Approximately 0.52 Mbits of on-chip RAM (516,096 total RAM bits) for FIFOs, buffers, and small on-chip data storage.
• I/O Count & Interface Flexibility – 346 user I/Os enable dense external connectivity for sensors, peripherals, and high-pin-count interfaces. The Cyclone III family supports a broad set of I/O standards for diverse system requirements.
• Clock Management – Cyclone III devices include multiple PLL resources per device (family-level feature) to support clock synthesis and phase alignment across system interfaces.
• Power – Low-power family architecture (TSMC low-power process at device-family level) with a device core supply range of 1.15 V to 1.25 V to match modern power-rail architectures.
• Industrial Temperature Range – Rated for operation from −40 °C to 100 °C, making it suitable for industrial environments.
• Package & Mounting – 484‑FBGA (supplier package 484‑UBGA, 19 × 19) surface-mount package for compact PCB integration.
• Compliance – RoHS compliant, supporting environmental and regulatory requirements for many production programs.

Typical Applications

• Industrial Automation – Implement custom control logic, signal conditioning, and deterministic I/O handling within industrial control modules operating across −40 °C to 100 °C.
• Embedded Systems – Provide glue logic, peripheral aggregation, and protocol conversion for compact embedded platforms that require on-chip RAM and flexible I/O.
• Communications & Interfaces – Serve as a configurable interface bridge or protocol adapter where a high I/O count and programmable timing are needed.

Unique Advantages

• Balanced Logic and Memory: 15,408 logic elements paired with approximately 0.52 Mbits of embedded memory allow both control-centric and data-path functions on a single device, reducing board-level components.
• High I/O Density: 346 I/Os support complex external connectivity without resorting to multiple devices, simplifying PCB routing and BOM.
• Industrial Reliability: Specified operating range of −40 °C to 100 °C and industrial grade classification support deployment in harsher environments.
• Low-Power Operation: Family-level low-power process characteristics and a narrow core voltage range (1.15 V–1.25 V) help minimize system power consumption.
• Compact Package: 484‑FBGA (19 × 19 UBGA) enables a high-pin-count solution in a relatively small footprint for space-constrained designs.
• Regulatory Ready: RoHS compliance simplifies environmental compliance for production builds.

Why Choose EP3C16U484I7N?

The EP3C16U484I7N positions itself as a versatile mid-range Cyclone III FPGA offering predictable logic capacity, embedded memory and a high number of I/Os in an industrial-grade package. It is well suited to designers who need an integrated, low-power FPGA platform for embedded control, interface conversion and system integration tasks.

As a member of the Cyclone III family, it benefits from family-level architecture features and an established IP ecosystem, enabling scalable designs and reduced development time for production programs that prioritize power efficiency and compact PCB integration.

Request a quote or submit your requirements to receive pricing and availability for the EP3C16U484I7N.