EP3C25E144A7N

The EP3C25E144A7N is a Cyclone III family FPGA that delivers mid-range logic capacity with low-power silicon optimizations from the Cyclone III device family. It combines a substantial array of logic elements, embedded memory, and on-chip clock management to address high-volume, low-power, cost-sensitive designs.

Designed for surface-mount PCB implementations, this device is provided in a 144-LQFP exposed-pad package, supports a 1.15 V to 1.25 V core supply range, and is qualified to AEC-Q100 for automotive applications requiring extended temperature operation.

Key Features

• Logic Capacity Approximately 24,624 logic elements enabling mid-range integration and complex combinational/sequential logic implementation.
• Configurable Logic Blocks 1,539 CLBs for structured logic partitioning and resource allocation.
• Embedded Memory Approximately 0.61 Mbits of on-chip RAM for buffering, FIFOs, and small local data storage.
• I/O Resources 82 user I/Os to support multiple external interfaces and board-level connectivity.
• Clock Management Family-level support for four PLLs per device with up to five outputs per PLL for flexible clock synthesis and distribution.
• Power and Supply Core voltage supply range 1.15 V to 1.25 V consistent with low-power Cyclone III process optimizations.
• Package and Mounting 144-LQFP exposed pad (supplier package: 144-EQFP, 20 × 20) in a surface-mount form factor for reliable thermal and mechanical performance.
• Automotive Qualification AEC-Q100 qualification and an operating temperature range of −40 °C to 125 °C for in-vehicle and other temperature-challenged environments.
• Standards and Compliance RoHS compliant.

Typical Applications

• Automotive Systems Suited for in-vehicle processing and control subsystems where AEC-Q100 qualification and extended temperature range are required.
• Industrial Control Mid-range logic integration and robust I/O support make the device suitable for factory automation, motion control, and instrumentation tasks.
• Consumer and High-Volume Products Low-power process optimizations and cost-sensitive Cyclone III family attributes fit high-volume, battery-powered, and portable designs.
• Communications and Timing On-chip PLLs and flexible I/O count support clock management and interface bridging in communications and test equipment.

Unique Advantages

• Balanced Logic and Memory: ~24,624 logic elements combined with ~0.61 Mbits of embedded RAM provide a balance of logic density and local memory for many mid-range designs.
• Automotive-Grade Qualification: AEC-Q100 qualification and −40 °C to 125 °C rating enable deployment in temperature-challenged automotive environments.
• Low-Power Silicon: Based on the Cyclone III low-power process technology to help meet power budgets in portable and thermally constrained systems.
• Flexible Clocking: Multiple PLLs with multiple outputs enable versatile clock generation and distribution without external clock management ICs.
• Practical Package Choice: 144-LQFP exposed-pad packaging with surface-mount mounting supports effective thermal dissipation and standard PCB assembly workflows.
• Regulatory Compliance: RoHS compliance supports environmentally responsible product development and manufacturing.

Why Choose EP3C25E144A7N?

EP3C25E144A7N positions itself as a practical Cyclone III FPGA for designers who need mid-range logic capacity, on-chip memory, and robust clocking in a low-power silicon family. Its AEC-Q100 qualification and extended temperature range make it a suitable choice where automotive-level reliability is required, while the surface-mount 144-LQFP package simplifies board-level integration.

This device benefits designs that require a mix of logic density, moderate embedded RAM, flexible I/O, and clock management—all delivered within the Cyclone III family’s low-power and cost-sensitive design orientation.

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