EP3C25E144C8

IC FPGA 82 I/O 144EQFP
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 82 608256 24624 144-LQFP Exposed Pad

Quantity 1,542 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package144-EQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFP Exposed PadNumber of I/O82Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1539Number of Logic Elements/Cells24624
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits608256

Overview of EP3C25E144C8 – Cyclone® III FPGA, 24,624 logic elements, 82 I/Os, 144-LQFP Exposed Pad

The EP3C25E144C8 is an Intel Cyclone® III Field Programmable Gate Array (FPGA) provided in a 144-LQFP exposed pad package. It delivers a balance of low power and integration for high-volume, cost-sensitive designs that require reprogrammable logic and on-chip memory.

As a member of the Cyclone III device family, this FPGA targets applications that benefit from low-power operation, a high memory-to-logic ratio, and flexible I/O options, while offering a compact surface-mount package for streamlined board integration.

Key Features

  • Logic Capacity — 24,624 logic elements available to implement complex programmable logic and control functions.
  • Embedded Memory — 608,256 bits of on-chip RAM (approximately 0.608 Mbits) to support buffering, FIFOs, and local data storage.
  • I/O — 82 general-purpose I/O pins to support multiple external interfaces and peripheral connections.
  • Voltage Supply — Core operating voltage range of 1.15 V to 1.25 V for predictable power-domain design.
  • Clock Management — Cyclone III family features include up to four PLLs per device for clock synthesis, distribution, and dynamic reconfiguration.
  • Package & Mounting — 144-LQFP exposed pad (supplier package: 144-EQFP 20×20) in a surface-mount form factor for compact PCB layouts and thermal conduction through the exposed pad.
  • Operating Range — Commercial-grade temperature range of 0 °C to 85 °C suitable for consumer and industrial-adjacent applications within commercial limits.
  • RoHS Compliant — Meets RoHS environmental requirements for lead-free applications.

Typical Applications

  • Portable and Handheld Devices — Low-power Cyclone III architecture helps extend battery life and support thermally constrained enclosures.
  • Consumer Electronics — On-chip RAM and abundant logic enable local buffering and custom control logic for multimedia and interface tasks.
  • Communications and Protocol Bridging — 82 I/Os and PLL-based clock management support diverse signaling and timing requirements for protocol glue logic and interface conversion.
  • System Control and Instrumentation — Reprogrammable logic and embedded memory allow flexible implementation of control algorithms, data acquisition preprocessing, and custom peripherals.

Unique Advantages

  • Highly integrated logic and memory: 24,624 logic elements combined with approximately 0.608 Mbits of embedded RAM reduce external component needs and simplify PCB designs.
  • Low-power family architecture: Cyclone III devices are optimized for reduced power consumption, helping meet tight system power budgets.
  • Flexible clocking: Family-level support for multiple PLLs enables robust clock generation, phase shifting, and dynamic reconfiguration without reprogramming the entire device.
  • Compact, manufacturable package: 144-LQFP exposed pad surface-mount package supports streamlined assembly and improved thermal performance through the exposed pad.
  • Commercial temperature suitability: Operates across a 0 °C to 85 °C range to match common consumer and commercial product requirements.

Why Choose EP3C25E144C8?

The EP3C25E144C8 delivers a practical balance of programmable logic capacity, embedded memory, and flexible I/O in a compact 144-LQFP exposed pad package. It is well suited for designers building cost-sensitive, power-aware systems that require on-board reprogrammability and integrated clock management.

Choosing this Cyclone III FPGA provides a scalable, commercially rated solution for consumer, portable, and communications applications where integration, low power, and predictable thermal behavior are important. The device leverages Cyclone III family features to simplify system design and reduce BOM complexity.

Request a quote or submit a product inquiry to receive pricing, availability, and ordering information for EP3C25E144C8.

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