EP3C25E144I7

The EP3C25E144I7 is a Cyclone III family FPGA in a 144‑LQFP exposed‑pad package, offering 24,624 logic elements and approximately 0.61 Mbits of embedded memory. Designed for industrial applications, it targets high‑volume, low‑power, cost‑sensitive designs that require flexible I/O and programmable logic integration.

This device operates from a core voltage range of 1.15 V to 1.25 V, supports up to 82 user I/Os, and is specified for an operating temperature range of −40 °C to 100 °C. It is RoHS‑compliant and supplied in a 144‑pin surface‑mount package with exposed pad.

Key Features

• Programmable Logic Capacity — 24,624 logic elements provide substantial on‑chip logic for mid‑range FPGA designs and custom digital functions.
• Embedded Memory — Approximately 0.61 Mbits of on‑chip RAM for buffering, state storage, and implementation of memory‑based functions.
• I/O and Interface Flexibility — Up to 82 user I/Os to support parallel interfaces, control signals, and peripheral connectivity in a compact package.
• Low‑Voltage Core — Core supply range of 1.15 V to 1.25 V to match low‑power system designs and standard Cyclone III platform voltages.
• Industrial Temperature Range — Specified operation from −40 °C to 100 °C for deployment in industrial and thermally demanding environments.
• Package and Mounting — 144‑LQFP exposed pad (supplier package: 144‑EQFP 20×20) in a surface‑mount form factor for straightforward PCB integration and thermal dissipation.
• Regulatory Compliance — RoHS‑compliant for environmental and manufacturing requirements.
• Cyclone III Family Advantages — Family features include low‑power operation and architecture capabilities common to Cyclone III devices, such as integrated clock management and a broad set of FPGA resources.

Typical Applications

• Industrial Control and Automation — Implement custom motor control logic, I/O aggregation, and protocol bridging while meeting industrial temperature requirements.
• Communications and Networking — Use the device for mid‑range packet processing, interface bridging, and protocol adaptation leveraging flexible I/O and embedded memory.
• Embedded Systems and Appliance Control — Integrate control logic, user interfaces, and peripheral handling for high‑volume, low‑power products.
• Instrumentation and Test Equipment — Implement custom timing, data acquisition pre‑processing, and control functions in a compact surface‑mount package.

Unique Advantages

• Substantial Logic Density: 24,624 logic elements enable complex custom logic and state machines without external ASICs.
• Compact, Thermally Aware Package: 144‑LQFP with exposed pad provides a small board footprint while facilitating heat dissipation for sustained operation.
• Industrial Reliability: Rated for −40 °C to 100 °C operation, suitable for deployment in harsh or wide‑temperature environments.
• Balanced Memory and I/O: Approximately 0.61 Mbits of embedded RAM and 82 I/Os offer a practical balance for buffering and peripheral integration.
• Low‑Voltage Core Compatibility: 1.15 V to 1.25 V supply range aligns with low‑power system designs and standard Cyclone III power rails.
• Standards‑Friendly FPGA Family: Leverages Cyclone III family architecture traits—such as low power and integrated clock resources—useful for scalable product designs.

Why Choose EP3C25E144I7?

The EP3C25E144I7 places a mid‑range Cyclone III FPGA into a compact, industrially rated package, delivering a practical combination of logic density, embedded memory, and flexible I/O for cost‑sensitive, low‑power designs. Its exposed‑pad 144‑LQFP footprint and surface‑mount mounting simplify PCB implementation and thermal management while supporting industrial temperature operation.

This device is well suited for engineers building mid‑density programmable solutions—where integration, reliability over temperature, and manageable power requirements are priorities. Choosing this part lets you leverage Cyclone III family capabilities to scale designs and reduce system BOM while keeping development within a familiar FPGA architecture.

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