EP3C25F256C6N

The EP3C25F256C6N is a Cyclone® III Field Programmable Gate Array (FPGA) IC from Intel, built on the Cyclone III device family architecture. It delivers a balance of logic capacity, embedded memory, and I/O count targeted at cost-sensitive, low-power commercial designs.

As a commercial-grade device (0 °C to 85 °C) with a 1.15 V to 1.25 V core supply range and RoHS compliance, this part is suited for portable and embedded applications where power efficiency, integration, and predictable operating conditions are important.

Key Features

• Logic Capacity  24,624 logic elements provide the programmable fabric for custom digital functions and system logic integration.
• Embedded Memory  Approximately 0.61 Mbits of on-chip RAM (608,256 bits) for FIFOs, buffers, and local data storage.
• I/O Resources  156 general-purpose I/Os delivered in a 256‑LBGA package, enabling diverse interface connectivity and board-level routing options.
• Clock Management  Cyclone III family devices include multiple PLLs for clock generation and management; this supports flexible clocking and phase control in system designs.
• Low-Power Architecture  Built on the Cyclone III low-power process with silicon and software optimizations to minimize power consumption for battery-powered and thermally constrained applications.
• Package & Mounting  256‑LBGA (supplier package 256‑FBGA, 17 × 17) with surface-mount construction for compact PCB implementations.
• Commercial Operating Range  Rated for 0 °C to 85 °C operation and specified as commercial grade.
• Standards & Compliance  RoHS compliant.

Typical Applications

• Portable and Handheld Electronics  Low-power Cyclone III architecture and modest on-chip memory make the device suitable for battery-operated products requiring logic integration and efficient power use.
• Consumer and Communications Interfaces  High I/O count and flexible I/O standard support at the family level accommodate diverse interface requirements for consumer and communications modules.
• Embedded Control and Signal Processing  Ample logic elements and embedded RAM enable glue logic, protocol handling, and mid-level acceleration tasks in embedded systems.
• High-Volume, Cost-Sensitive Designs  Cyclone III family positioning emphasizes low cost and high functionality for products produced at scale.

Unique Advantages

• Balanced Integration: Combines a substantial logic element count with embedded RAM and a high I/O count to reduce external components and simplify board design.
• Power-Aware Design: Family-level low-power process and optimizations help lower static and dynamic power for thermally constrained or battery-powered applications.
• Flexible Clocking: On-device PLL resources support multiple clock domains and phase/frequency adjustments without external clock management ICs.
• Compact Packaging: 256‑LBGA surface-mount package minimizes PCB footprint while providing robust I/O for system integration.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C, matching typical commercial embedded product requirements.
• RoHS Compliant: Meets RoHS requirements for lead-free, environmentally conscious designs.

Why Choose EP3C25F256C6N?

EP3C25F256C6N places Cyclone III family capabilities into a compact, commercial-grade FPGA package that matches the needs of cost- and power-sensitive embedded projects. With 24,624 logic elements, approximately 0.61 Mbits of on-chip RAM, and 156 I/Os, it supports a wide range of mid-complexity digital functions, interface handling, and embedded acceleration tasks.

Engineers benefit from the Cyclone III device family heritage—focused on low power, practical integration, and a collection of family-level resources such as PLLs and verified IP—which helps accelerate development and reduce BOM complexity for production designs.

Request a quote or submit a purchase inquiry for EP3C25F256C6N to begin integrating this Cyclone III FPGA into your next commercial embedded design.