EP3C25F256C7

The EP3C25F256C7 is a Cyclone® III family Field Programmable Gate Array (FPGA) in a 256‑ball LBGA package, offering 24,624 logic elements and approximately 0.61 Mbits of embedded memory. Designed for commercial-grade applications, this device targets designs that need mid-range logic density, substantial on-chip RAM, and a moderate I/O count in a compact surface-mount package.

Its architecture is part of the Cyclone III device family, which emphasizes low power and higher integration to support cost- and power-sensitive systems while providing flexible I/O and clock management capabilities suitable for a wide range of embedded and communications tasks.

Key Features

• Logic Capacity — 24,624 logic elements provide mid-range programmable logic resources for custom digital functions and glue logic.
• Embedded Memory — 608,256 bits of on-chip RAM (approximately 0.61 Mbits) for data buffering, FIFOs, and small embedded storage.
• I/O Density — 156 user I/O pins enable multiple peripheral interfaces, sensor connections, and board-level bridging tasks.
• Low‑Voltage Core — Core supply range 1.15 V to 1.25 V to align with low-power system designs.
• Package & Mounting — 256-LBGA package, surface-mount; supplier device package listed as 256-FBGA (17×17), providing a compact footprint for space-constrained PCBs.
• Operating Range — Commercial-grade operating temperature from 0 °C to 85 °C for standard commercial environments.
• RoHS Compliant — Meets RoHS environmental requirements for lead-free designs.
• Cyclone III Family Characteristics — Family-level attributes include low-power operation, robust clock management (multiple PLLs in the family), and broad I/O standard support for flexible system interfacing.

Typical Applications

• Communications Equipment — Implement protocol bridging, packet handling, or interface arbitration using the device’s logic and I/O capacity.
• Embedded Systems — Custom control, data aggregation, and peripheral interfacing where moderate logic density and on-chip RAM simplify board design.
• Test & Measurement — Real-time signal preprocessing, trigger logic, and I/O routing benefitting from the device’s programmable logic and multiple I/Os.
• Consumer Electronics — User interface control, video preprocessing, or feature integration in space-constrained, low-power consumer devices.

Unique Advantages

• Balanced Logic and Memory: 24,624 logic elements paired with approximately 0.61 Mbits of RAM offer a practical balance for mid-range programmable designs.
• High I/O Count in Compact Package: 156 I/Os in a 256‑ball LBGA/supplier 256‑FBGA (17×17) package reduces PCB area while keeping system connectivity flexible.
• Low-Voltage Operation: 1.15–1.25 V core supply supports lower power budgets and compatibility with modern low-voltage system architectures.
• Commercial Temperature Suitability: Rated 0 °C to 85 °C for reliable operation in standard commercial environments.
• Regulatory Compliance: RoHS compliance supports lead‑free manufacturing and regulatory requirements.
• Part of a Low-Power FPGA Family: Being a Cyclone III device provides access to family-level low-power design attributes and clock-management features described in the Cyclone III documentation.

Why Choose EP3C25F256C7?

The EP3C25F256C7 positions itself as a practical mid-range Cyclone III FPGA that combines 24,624 logic elements, substantial embedded RAM, and 156 I/Os in a compact surface-mount LBGA package. It is suited for designers who need a cost-conscious, low-voltage FPGA for commercial applications requiring moderate logic density and flexible I/O.

As part of the Cyclone III family, this device benefits from the family’s low-power focus and architectural features for system integration, making it a viable option for developers seeking scalable, power-aware programmable logic in space-constrained designs.

Request a quote or submit an inquiry to purchase the EP3C25F256C7 and evaluate its fit for your next mid-range FPGA design project.