EP3C25F256C7ES

The EP3C25F256C7ES is a Cyclone III family field programmable gate array (FPGA) in a 256-LBGA package designed for low-power, cost-sensitive applications. Built on the Cyclone III device family architecture, it provides a balance of programmable logic, embedded memory, and I/O in a compact surface-mount package suitable for commercial designs.

This device targets applications requiring moderate logic density and on-chip memory, offering features from the Cyclone III family such as low-power process optimizations, multiple PLLs for clock management, and a selection of I/O capabilities for system integration.

Key Features

• Logic Capacity  Approximately 24,624 logic elements (cells) to implement custom digital logic and state machines.
• Embedded Memory  Approximately 0.61 Mbits of on-chip RAM (608,256 total RAM bits) for data buffering, FIFOs, and small embedded storage.
• I/O Resources  156 user I/Os to interface with external peripherals and system signals.
• Low-Voltage Operation  Core voltage supply range of 1.15 V to 1.25 V supporting the Cyclone III low-power silicon optimizations.
• Clock Management  Family-level support includes four phase-locked loops (PLLs) per device for flexible clock synthesis and distribution.
• Package and Mounting  Surface-mount 256-LBGA package (supplier package listed as 256-FBGA, 17×17) for compact PCB integration.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation.
• RoHS Compliant  Meets RoHS environmental requirements.

Typical Applications

• Portable and Handheld Devices  Low-power characteristics and on-chip memory make this device suitable for battery-powered or thermally constrained products.
• Embedded Processing and Custom Logic  Logic capacity and PLL resources support custom control, glue logic, and embedded processing tasks in mid-range systems.
• High I/O, Mid-Density Systems  With 156 I/Os, the FPGA is a fit for designs that require moderate I/O connectivity and protocol interfacing.
• Cost-Sensitive, High-Volume Products  The Cyclone III family positioning targets high-volume designs where low cost and low power are priorities.

Unique Advantages

• Optimized for Low Power  Built on low-power process technology with a 1.15–1.25 V core range to reduce static power consumption in end systems.
• Sufficient Logic and Memory Density  Approximately 24,624 logic elements and ~0.61 Mbits of embedded RAM provide a practical balance for mid-range FPGA designs.
• Flexible Clocking  Multiple PLLs provide system-level clocking options without consuming additional external components.
• Compact, Surface-Mount Package  256-LBGA packaging enables a small PCB footprint for space-constrained applications.
• Commercial Temperature Rating  Rated for 0 °C to 85 °C to suit mainstream commercial product environments.
• Environmental Compliance  RoHS compliance supports regulatory and sustainability requirements.

Why Choose EP3C25F256C7ES?

The EP3C25F256C7ES delivers a balanced Cyclone III FPGA option for designers who need moderate logic density, embedded memory, and a healthy count of I/Os in a compact surface-mount package. Its low-voltage operation and family-level low-power features align with cost-sensitive, high-volume product requirements while providing the clocking and integration resources useful for system-level design.

This device is well-suited to commercial embedded designs that prioritize energy efficiency, compact packaging, and a flexible mix of logic, memory, and I/O. Selection of this FPGA leverages the Cyclone III family ecosystem and device-level features to simplify mid-range digital design work.

Request a quote or submit a sales inquiry to evaluate EP3C25F256C7ES for your next design and obtain pricing and availability information.