EP3C25F256A7N

The EP3C25F256A7N is an Intel Cyclone® III field programmable gate array (FPGA) offered in a 256-ball BGA package for surface-mount applications. It belongs to the Cyclone III device family, a low-power FPGA platform built on TSMC low-power process technology and designed for high-volume, cost-sensitive designs.

With 24,624 logic elements, approximately 0.6 Mbits of embedded memory, and 156 user I/Os, this device targets embedded control, interface bridging, and system integration tasks where low power, integration density, and automotive qualification are required.

Key Features

• Logic Capacity  Approximately 24,624 logic elements providing substantial programmable logic for mid-range designs.
• Embedded Memory  Approximately 0.6 Mbits (608,256 bits) of on-chip RAM to support buffering, FIFOs, and local data storage.
• I/O and Package  156 user I/Os in a 256-ball BGA package; surface-mount mounting for compact PCB designs. Supplier package reference: 256-FBGA (17×17).
• Low-Voltage Core  Core supply range of 1.15 V to 1.25 V to support low-power system architectures.
• Automotive Qualification  AEC-Q100 qualification and Automotive grade rating with an operating temperature range of −40 °C to 125 °C for automotive system integration.
• Low-Power Family Characteristics  Cyclone III family is optimized for low static power consumption through process and silicon-level power optimizations, supporting thermally constrained and battery-powered applications.
• Clocking and System Integration  Cyclone III family devices include advanced clock management (family-level features such as multiple PLLs and cascaded outputs) and a library of pre-built IP to accelerate system design.
• Standards and Ecosystem  Part of the Cyclone III family with documented support in the device handbook and associated design flows and IP resources for rapid development.
• Compliance  RoHS compliant.

Typical Applications

• Automotive Systems  Engine control modules, body electronics, and sensor interfaces where AEC-Q100 qualification and extended temperature range are required.
• Embedded Control and Motor Drive  Deterministic logic and local memory enable motor control sequencing, sensor fusion, and deterministic control loops.
• Interface Bridging and Protocol Conversion  High I/O count and flexible I/O support make the device suitable for bridging between multiple digital interfaces and custom protocol translations.
• Edge Processing  On-chip RAM and logic provide resources for real-time pre-processing and feature extraction at the network edge.

Unique Advantages

• Automotive-Ready Qualification: The device is AEC-Q100 qualified and rated for −40 °C to 125 °C operation, supporting integration into automotive electronics.
• Balanced Integration: Combines mid-range logic density with embedded memory and a high I/O count to reduce external component count and simplify board-level design.
• Low-Voltage, Low-Power Operation: Core supply from 1.15 V to 1.25 V and family-level low-power optimizations reduce system power consumption and thermal requirements.
• Compact Surface-Mount Package: 256-ball BGA in a 17×17 footprint enables space-efficient PCB layouts for compact systems.
• Proven Design Ecosystem: Part of the Cyclone III family with documented device handbook guidance and pre-built IP to accelerate development and validation.

Why Choose EP3C25F256A7N?

The EP3C25F256A7N is positioned for designs that require a mid-range, low-power FPGA with automotive qualification and a compact BGA footprint. Its combination of approximately 24,624 logic elements, approximately 0.6 Mbits of embedded RAM, and 156 user I/Os offers a practical balance of programmable logic, memory, and I/O for embedded control, interface, and edge-processing applications.

Choose this Cyclone III device when you need a validated FPGA family ecosystem, predictable power and thermal behavior, and AEC-Q100 qualification for vehicle-level deployments—delivering long-term design stability and integration efficiency.

Request a quote or submit an inquiry to get pricing and availability for EP3C25F256A7N and to discuss how it fits your application requirements.