EP3C25E144C8N

IC FPGA 82 I/O 144EQFP
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 82 608256 24624 144-LQFP Exposed Pad

Quantity 118 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package144-EQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFP Exposed PadNumber of I/O82Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1539Number of Logic Elements/Cells24624
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits608256

Overview of EP3C25E144C8N – Cyclone® III FPGA, 24,624 logic elements, ~0.6 Mbits RAM, 82 I/Os, 144-LQFP

The EP3C25E144C8N is a Cyclone® III family Field Programmable Gate Array (FPGA) optimized for commercial, cost-sensitive applications that require a balance of logic capacity, on-chip memory, and I/O density. Built on the Cyclone III device family architecture, it targets designs that need low power operation, flexible clocking, and embedded memory resources within a compact surface-mount package.

This device is well suited for mid-range digital logic, embedded control, and I/O-bridging tasks where a commercial temperature range (0 °C to 85 °C), RoHS compliance, and a 144-LQFP exposed pad package are required.

Key Features

  • Logic Capacity — 24,624 logic elements for implementing mid-range combinational and sequential logic functions.
  • Embedded Memory — 608,256 total RAM bits (approximately 0.6 Mbits) to support on-chip buffering, FIFOs, and small data stores.
  • I/O Resources — 82 user I/Os to support multiple peripheral interfaces and board-level signal routing requirements.
  • Power Supply — Core voltage range of 1.15 V to 1.25 V for core power planning and regulator selection.
  • Commercial Grade — Rated for 0 °C to 85 °C operating temperature; suitable for commercial applications.
  • Package and Mounting — 144-LQFP exposed pad package; surface-mount mounting type. Supplier device package listed as 144-EQFP (20x20).
  • Family-Level Low-Power Design — Part of the Cyclone III family based on a low-power process technology, delivering a balance of functionality and power efficiency.
  • Clock Management — Cyclone III family devices include dedicated phase-locked loop (PLL) resources for flexible clock synthesis and management.
  • RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

  • Embedded Control — Implement custom control logic and state machines using abundant logic elements and on-chip RAM for temporary data storage.
  • Interface and I/O Bridging — Use the 82 I/Os to bridge between different peripherals, handle protocol translation, or aggregate signals for system-level controllers.
  • Low-Power Portable Electronics — Leverage Cyclone III family low-power characteristics for battery-powered or thermally constrained designs in the commercial space.
  • Prototyping and Product Development — Mid-range logic and memory resources make this device suitable for proofs-of-concept and cost-sensitive production designs.

Unique Advantages

  • Balanced Logic and Memory: 24,624 logic elements paired with approximately 0.6 Mbits of embedded memory provide the right resource mix for many mid-range designs.
  • Compact, Surface-Mount Package: 144-LQFP exposed pad package supports compact PCB layouts while providing thermal path through the exposed pad.
  • Commercial Temperature Range: Rated 0 °C to 85 °C for reliable operation in typical commercial environments.
  • Flexible Clocking: Family-level PLL resources enable robust clock management and on-device frequency synthesis for diverse timing needs.
  • Regulatory and Assembly Friendly: RoHS compliance and standard surface-mount package streamline manufacturing and regulatory acceptance.
  • Vendor Ecosystem: As a Cyclone III family device, it benefits from documented family features, device handbook resources, and available IP cores for accelerated development.

Why Choose EP3C25E144C8N?

The EP3C25E144C8N positions itself as a mid-range Cyclone III FPGA that combines a meaningful logic element count, on-chip memory, and a healthy I/O complement in a compact surface-mount 144-LQFP exposed pad package. Its commercial-grade operating range, controlled core-voltage window, and RoHS compliance make it a practical choice for cost-sensitive, low-power commercial designs that require programmable logic and embedded memory.

Designers seeking a proven FPGA family with documented low-power features, clock management capabilities, and an established ecosystem of IP and development resources will find the EP3C25E144C8N suitable for prototyping through production of mid-complexity systems.

Request a quote or submit an RFQ to check availability and pricing for EP3C25E144C8N and begin integrating this Cyclone III FPGA into your next commercial design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up