EP3C25E144C8N
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 82 608256 24624 144-LQFP Exposed Pad |
|---|---|
| Quantity | 118 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-EQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP Exposed Pad | Number of I/O | 82 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1539 | Number of Logic Elements/Cells | 24624 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 608256 |
Overview of EP3C25E144C8N – Cyclone® III FPGA, 24,624 logic elements, ~0.6 Mbits RAM, 82 I/Os, 144-LQFP
The EP3C25E144C8N is a Cyclone® III family Field Programmable Gate Array (FPGA) optimized for commercial, cost-sensitive applications that require a balance of logic capacity, on-chip memory, and I/O density. Built on the Cyclone III device family architecture, it targets designs that need low power operation, flexible clocking, and embedded memory resources within a compact surface-mount package.
This device is well suited for mid-range digital logic, embedded control, and I/O-bridging tasks where a commercial temperature range (0 °C to 85 °C), RoHS compliance, and a 144-LQFP exposed pad package are required.
Key Features
- Logic Capacity — 24,624 logic elements for implementing mid-range combinational and sequential logic functions.
- Embedded Memory — 608,256 total RAM bits (approximately 0.6 Mbits) to support on-chip buffering, FIFOs, and small data stores.
- I/O Resources — 82 user I/Os to support multiple peripheral interfaces and board-level signal routing requirements.
- Power Supply — Core voltage range of 1.15 V to 1.25 V for core power planning and regulator selection.
- Commercial Grade — Rated for 0 °C to 85 °C operating temperature; suitable for commercial applications.
- Package and Mounting — 144-LQFP exposed pad package; surface-mount mounting type. Supplier device package listed as 144-EQFP (20x20).
- Family-Level Low-Power Design — Part of the Cyclone III family based on a low-power process technology, delivering a balance of functionality and power efficiency.
- Clock Management — Cyclone III family devices include dedicated phase-locked loop (PLL) resources for flexible clock synthesis and management.
- RoHS Compliant — Meets RoHS environmental requirements.
Typical Applications
- Embedded Control — Implement custom control logic and state machines using abundant logic elements and on-chip RAM for temporary data storage.
- Interface and I/O Bridging — Use the 82 I/Os to bridge between different peripherals, handle protocol translation, or aggregate signals for system-level controllers.
- Low-Power Portable Electronics — Leverage Cyclone III family low-power characteristics for battery-powered or thermally constrained designs in the commercial space.
- Prototyping and Product Development — Mid-range logic and memory resources make this device suitable for proofs-of-concept and cost-sensitive production designs.
Unique Advantages
- Balanced Logic and Memory: 24,624 logic elements paired with approximately 0.6 Mbits of embedded memory provide the right resource mix for many mid-range designs.
- Compact, Surface-Mount Package: 144-LQFP exposed pad package supports compact PCB layouts while providing thermal path through the exposed pad.
- Commercial Temperature Range: Rated 0 °C to 85 °C for reliable operation in typical commercial environments.
- Flexible Clocking: Family-level PLL resources enable robust clock management and on-device frequency synthesis for diverse timing needs.
- Regulatory and Assembly Friendly: RoHS compliance and standard surface-mount package streamline manufacturing and regulatory acceptance.
- Vendor Ecosystem: As a Cyclone III family device, it benefits from documented family features, device handbook resources, and available IP cores for accelerated development.
Why Choose EP3C25E144C8N?
The EP3C25E144C8N positions itself as a mid-range Cyclone III FPGA that combines a meaningful logic element count, on-chip memory, and a healthy I/O complement in a compact surface-mount 144-LQFP exposed pad package. Its commercial-grade operating range, controlled core-voltage window, and RoHS compliance make it a practical choice for cost-sensitive, low-power commercial designs that require programmable logic and embedded memory.
Designers seeking a proven FPGA family with documented low-power features, clock management capabilities, and an established ecosystem of IP and development resources will find the EP3C25E144C8N suitable for prototyping through production of mid-complexity systems.
Request a quote or submit an RFQ to check availability and pricing for EP3C25E144C8N and begin integrating this Cyclone III FPGA into your next commercial design.

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