EP3C25E144C7N

The EP3C25E144C7N is a Cyclone® III field programmable gate array (FPGA) offered in a 144-LQFP exposed pad package. It delivers 24,624 logic elements with approximately 0.6 Mbits of embedded memory and 82 user I/Os, targeting high-volume, low-power, cost-sensitive applications.

Built on the Cyclone III device family architecture, this device is positioned for designs that require a balance of integration, low static power, and flexible I/O capability in a surface-mount commercial-grade package.

Key Features

• Logic Capacity — 24,624 logic elements (LEs) suitable for mid-range programmable logic integration and custom digital functions.
• Embedded Memory — Approximately 0.6 Mbits of total on-chip RAM for buffering, state storage, and small embedded data structures.
• I/O Resources — 82 user I/Os to support a variety of external interfaces and board-level connectivity in a single device.
• Low-Voltage Core Supply — Core voltage range 1.15 V to 1.25 V to meet the device’s specified operating requirements.
• Package & Mounting — 144-LQFP exposed pad package (supplier device package 144-EQFP, 20×20) in a surface-mount form factor for PCB assembly and thermal dissipation.
• Commercial Temperature Range — Rated for 0 °C to 85 °C operation for standard commercial applications.
• RoHS Compliant — Meets RoHS environmental requirements for lead-free assembly and manufacturing.
• Cyclone III Family Features — Family-level capabilities include low-power operation, multi-function PLLs, flexible I/O standard support, and on-chip features designed for system integration and power efficiency.

Typical Applications

• Portable and Handheld Electronics — Low-power Cyclone III family characteristics help extend battery life and reduce cooling needs for compact, battery-operated devices.
• Embedded Control and Signal Processing — Mid-range logic capacity and embedded RAM enable custom control logic, protocol handling, and modest signal processing tasks.
• Interface Bridging and I/O Expansion — 82 I/Os provide flexibility for protocol conversion, sensor aggregation, and board-level interface consolidation.
• Cost-Sensitive High-Volume Products — The device’s balance of functionality, low static power, and surface-mount package suits designs where unit cost and power are primary considerations.

Unique Advantages

• Highly Integrated Logic and Memory: Combines 24,624 logic elements with on-chip RAM to reduce the need for external components and simplify PCB design.
• Compact, Assembly-Friendly Package: 144-LQFP exposed pad in a 20×20 outline provides a standard surface-mount footprint with improved thermal path to PCB.
• Low-Voltage Core Operation: 1.15 V–1.25 V supply range supports power-efficient designs and predictable core power budgeting.
• Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream electronics manufacturing and deployments.
• Family-Level Power and Integration Features: Leverages Cyclone III family optimizations for low static power and system integration capabilities, helping reduce overall system power and BOM complexity.

Why Choose EP3C25E144C7N?

The EP3C25E144C7N provides a practical mid-range FPGA solution within the Cyclone III family, combining 24,624 logic elements, approximately 0.6 Mbits of embedded memory, and 82 I/Os in a commercial-grade 144-LQFP exposed pad package. Its low-voltage core, family-level low-power optimizations, and flexible I/O count make it well suited for designers targeting cost-sensitive, low-power, and compact system designs.

This device is a fit for teams needing scalable FPGA capability with predictable thermal and power characteristics, and for projects that benefit from Cyclone III family features focused on integration and power efficiency.

Request a quote or submit an RFQ to receive pricing and availability information for EP3C25E144C7N.