EP3C25E144I7N

The EP3C25E144I7N is a Cyclone® III family field-programmable gate array (FPGA) offered in a 144‑lead LQFP exposed-pad package. It provides 24,624 logic elements, approximately 0.61 Mbits of embedded memory, and 82 user I/Os in a surface-mount package targeted at industrial-grade applications.

As a member of the Cyclone III device family, this device leverages low-power process and architecture optimizations to deliver a balance of functionality and power efficiency for cost-sensitive, high-volume, and thermally-challenged applications.

Key Features

• Logic Capacity — 24,624 logic elements for implementing mid-range combinational and sequential logic designs.
• Embedded Memory — Approximately 0.61 Mbits of on-chip RAM to support buffering, tables, and small data stores without external memory.
• I/O Resources — 82 general-purpose I/Os suitable for sensor interfaces, control signals, and peripheral connectivity.
• Power and Voltage — Core operating voltage range of 1.15 V to 1.25 V, consistent with Cyclone III low-power family characteristics.
• Package and Mounting — 144‑LQFP exposed pad (supplier package: 144‑EQFP 20×20) in a surface-mount form factor for compact PCB layouts and thermal conduction through the exposed pad.
• Industrial Temperature Range — Specified to operate from −40 °C to 100 °C for reliable performance in industrial environments.
• RoHS Compliant — Meets RoHS requirements for lead-free manufacturing and assembly processes.
• Cyclone III Family Advantages — Family-level attributes include low-power silicon optimizations, on-chip clock management (PLLs), and features intended to support high functionality with reduced power consumption.

Typical Applications

• Industrial Automation — Sensor aggregation, motor control logic, and real-time I/O handling leveraging the industrial temperature rating and 82 I/O pins.
• Portable and Handheld Equipment — Low-power family characteristics support battery-conscious designs and thermally constrained form factors.
• Communications and I/O Bridging — Mid-range logic capacity and embedded memory for protocol bridging, data buffering, and custom interface logic.
• Embedded Control Systems — On-chip RAM and flexible I/O for implementing control loops, state machines, and integration with external peripherals.

Unique Advantages

• Right-sized Logic Capacity: 24,624 logic elements provide a balance of integration and cost for mid-range FPGA designs.
• Compact, Thermally-Conscious Package: 144‑LQFP exposed-pad package simplifies PCB layout and helps with heat dissipation in constrained designs.
• Industrial Reliability: Rated for −40 °C to 100 °C operation to meet industrial deployment requirements.
• Low-Power Family Attributes: Built on Cyclone III low-power device technology, offering design-level options to manage static and dynamic power.
• On-chip Memory for Reduced BOM: Approximately 0.61 Mbits of embedded RAM reduces dependence on external memory components for small to moderate buffering needs.
• RoHS Compliance: Supports lead-free manufacturing and global environmental requirements.

Why Choose EP3C25E144I7N?

The EP3C25E144I7N positions itself as a practical mid-range Cyclone III FPGA option where a balance of logic capacity, on-chip memory, I/O flexibility, and industrial temperature range are required. Its combination of approximately 24,624 logic elements, ~0.61 Mbits of embedded RAM, and 82 I/Os in a 144‑LQFP exposed-pad package makes it well suited to embedded control, communications bridging, and industrial automation designs that need reliable operation across −40 °C to 100 °C.

Choose this device when you need a cost-sensitive FPGA solution from the Cyclone III family that emphasizes power-aware operation, adequate on-chip memory, and a compact, manufacturable package for volume applications.

Request a quote or submit a procurement inquiry to receive pricing, availability, and lead-time information for EP3C25E144I7N.