EP3C25F256C6

The EP3C25F256C6 is a Cyclone III family FPGA offering a balance of high functionality, low power and cost-efficiency for high-volume, cost-sensitive designs. It implements a mid-range FPGA architecture with 24,624 logic elements and approximately 0.608 Mbits of embedded memory, suited for applications that require a compact, power-conscious programmable fabric.

With family-level optimizations for low-power operation and on-chip system integration features such as multiple PLLs and a diverse set of I/O capabilities, this device targets portable, consumer and general commercial embedded designs where power, integration and I/O density matter.

Key Features

• Logic Capacity — 24,624 logic elements, providing mid-range programmable logic resources for combinational and sequential logic implementation.
• Embedded Memory — Approximately 0.608 Mbits of on-chip RAM for buffering, FIFOs and small data structures without external memory.
• I/O Count and Flexibility — 156 I/Os to support complex interfacing and board-level connectivity while accommodating a range of peripheral signals.
• Clock Management — Device family includes support for multiple PLLs to manage clock distribution, synthesis and phase control for system timing (family feature).
• Low-Power Process — Based on a low-power process technology and family-level power-aware design optimizations to reduce static power in compact systems.
• Power Supply — Core voltage range of 1.15 V to 1.25 V for the FPGA core.
• Package and Mounting — 256-LBGA package (supplier package noted as 256-FBGA, 17×17) in a surface-mount form factor for compact PCB integration.
• Operating Range and Grade — Commercial grade operation from 0 °C to 85 °C suitable for general-purpose embedded applications.
• Standards and Integration (Family capabilities) — Family supports a wide variety of I/O standards and system integration features such as adjustable I/O slew rates and on-chip termination calibration (family-level details).
• Compliance — RoHS compliant for regulatory environmental requirements.

Typical Applications

• Portable and Battery-Powered Devices — Low-power family characteristics make the device suitable for portable consumer products and handheld instrumentation where reduced power draw extends battery life.
• Embedded Control and Interface — Use as a programmable controller for sensor aggregation, motor/actuator interfaces or user interface management leveraging the available logic and I/O count.
• Consumer and High-Volume Electronics — Mid-range logic and compact 256-LBGA packaging support space-constrained, cost-sensitive consumer designs.
• Prototyping and System Integration — On-chip memory and clock-management features enable integration of glue logic, custom peripherals and timing functions in compact systems.

Unique Advantages

• Balanced Mid-Range Capacity: 24,624 logic elements provide substantial programmable resources without the cost and power of larger devices.
• Compact, Board-Level Friendly Package: 256-LBGA (surface mount) with a 17×17 supplier footprint supports high-density PCB layouts in confined enclosures.
• Embedded Memory On-Board: Approximately 0.608 Mbits of RAM reduces reliance on external memory for buffering and small data structures, simplifying BOM and layout.
• Broad I/O Count: 156 I/Os accommodate multiple interfaces and peripherals, enabling consolidation of interface logic onto a single device.
• Power-Optimized Silicon: Family-level low-power process and power-aware design features help meet thermal and battery budgets for commercial applications.
• Commercial Temperature Suitability: Rated 0 °C to 85 °C for a wide range of general-purpose embedded uses.

Why Choose EP3C25F256C6?

The EP3C25F256C6 positions itself as a cost-conscious, low-power mid-range FPGA solution for designers who need significant programmable logic, on-chip memory and a high I/O count in a compact surface-mount package. Its family-level focus on low power, clock management and I/O flexibility supports integration of multiple system functions while helping control board space and BOM complexity.

This device is a practical choice for teams building commercial embedded systems, consumer electronics, and portable products that require a scalable FPGA fabric backed by the Cyclone III family architecture and its collection of verified IP and design flows.

Request a quote or submit a procurement inquiry to learn pricing, availability and lead-time for EP3C25F256C6.