EP3C25F256C7N

The EP3C25F256C7N is a Cyclone III FPGA device offering mid-range logic density and on-chip memory in a 256-ball BGA package. It is designed for low-power, cost-sensitive applications that require a balance of programmable logic, embedded memory, and flexible I/O in a surface-mount package.

Built on the Cyclone III device family architecture, this device targets high-volume, low-power designs and applications that benefit from integrated clock management and a high memory-to-logic ratio.

Key Features

• Logic Capacity  24,624 logic elements provide programmable fabric for combinational and sequential logic implementation.
• On-chip Memory  Approximately 0.61 Mbits of embedded memory (608,256 bits) for buffering, lookup tables, and data storage.
• I/O Resources  156 user I/O pins to support diverse peripheral interfaces and board-level connectivity.
• Clock Management  Cyclone III family features include four phase-locked loops (PLLs) per device for flexible clock synthesis and distribution.
• Supply Voltage  Core supply range of 1.15 V to 1.25 V to match compatible system power rails.
• Package & Mounting &nbsp>256-LBGA (supplier package: 256-FBGA, 17×17) in a surface-mount format suitable for automated PCB assembly.
• Operating Range  Commercial grade operation from 0 °C to 85 °C.
• RoHS Compliant  Meets RoHS environmental compliance requirements.
• Family-Level Capabilities  Cyclone III family features such as low-power process technology, high memory-to-logic ratio, adjustable I/O slew rates, and support for multiple I/O standards are applicable to this device.

Typical Applications

• Portable and Handheld Devices  Low-power Cyclone III architecture and modest on-chip memory make this device suitable for battery-conscious portable designs.
• Cost-Sensitive Embedded Systems &nbsp>Provides programmable logic and embedded memory for control, glue logic, and protocol bridging in high-volume products.
• I/O-Constrained Systems  A high I/O count enables flexible interfacing with sensors, peripherals, and external memory in space-constrained designs.
• Clock-Intensive Designs  Integrated PLLs support clock synthesis and distribution for multi-domain timing and interface needs.

Unique Advantages

• Balanced Logic and Memory: Combines 24,624 logic elements with approximately 0.61 Mbits of embedded memory to support complex control and data-path functions without external memory in some use cases.
• Flexible I/O Count: 156 user I/Os let you implement multiple interfaces and reduce external glue logic.
• Power-Aware Family Architecture: Cyclone III family design emphasizes low power, which helps meet thermal and battery-life targets in portable and thermally constrained designs.
• On-Chip Clock Resources: Multiple PLLs per device simplify clocking architectures and reduce the need for external clock management components.
• Surface-Mount, BGA Packaging: 256-ball BGA package provides a compact footprint for higher-density PCB designs while supporting automated assembly.
• Commercial Temperature Grade: Specified for 0 °C to 85 °C operation to match a wide range of general-purpose electronic products.

Why Choose EP3C25F256C7N?

The EP3C25F256C7N delivers a practical mix of programmable logic, embedded memory, and I/O capacity in a compact 256-LBGA package. It is positioned for designers who need a low-power, cost-effective FPGA solution from the Cyclone III family that supports flexible clocking and a high memory-to-logic ratio.

This device is well suited to high-volume, cost-sensitive applications and general-purpose embedded systems where moderate logic density, on-chip RAM, and a substantial number of I/Os reduce external component count and simplify board-level design.

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