EP3C25F256I7N

The EP3C25F256I7N is an Intel Cyclone® III field-programmable gate array (FPGA) offered in a 256-LBGA (256‑FBGA, 17×17) package for surface-mount applications. It provides 24,624 logic elements and approximately 0.61 Mbits of embedded memory, making it suitable for designs that require mid-range logic density with significant on‑chip RAM and flexible I/O.

As part of the Cyclone III device family, this device targets high-volume, low-power and cost-sensitive applications. Its industrial-grade rating and extended operating temperature range make it appropriate for designs that must operate between −40 °C and 100 °C while meeting RoHS compliance requirements.

Key Features

• Logic Capacity 24,624 logic elements to implement mid-range programmable logic, control state machines, and glue‑logic functions.
• Embedded Memory Approximately 0.61 Mbits of on‑chip RAM for buffers, FIFOs, and small data tables without relying on external memory.
• I/O Count and Flexibility 156 user I/Os in a compact LBGA footprint, enabling multi‑channel interfaces and dense board layouts. The Cyclone III family supports adjustable I/O slew rates.
• Clocking Resources Family-level clock management including phase-locked loops (PLLs) for robust clock generation and distribution.
• Power Supply Core operating voltage: 1.15 V to 1.25 V, consistent with low-power Cyclone III process technology.
• Package and Mounting 256-LBGA (supplier package: 256-FBGA, 17×17) for surface-mount assembly, offering a compact solution for PCB-constrained designs.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C for applications that require extended thermal tolerance.
• Standards and Compliance RoHS compliant.

Typical Applications

• Portable and Handheld Devices Mid-range logic and low-power Cyclone III family characteristics support extended battery life and compact system designs.
• Embedded Control and Signal Processing On‑chip RAM and logic density enable local buffering, preprocessing, and glue logic for embedded controllers and sensor hubs.
• High‑I/O Interface Modules With 156 I/Os, the device is suitable for multi‑lane interfaces, protocol bridging, and I/O‑rich subsystems in communication or instrumentation equipment.
• Thermally Challenged Environments Low-power family design and industrial temperature rating help reduce cooling requirements and support operation in constrained thermal conditions.

Unique Advantages

• Highly integrated mid-range FPGA: 24,624 logic elements and on‑chip memory reduce the need for external components and simplify board-level design.
• Low-power family heritage: Cyclone III devices are built using low-power process technology to help meet power budgets for battery‑sensitive and thermally constrained systems.
• Compact, surface-mount package: 256-LBGA (17×17) footprint balances pin density and PCB space for compact product designs.
• Industrial temperature capability: −40 °C to 100 °C rating supports industrial deployments and extended-environment applications.
• Flexible I/O and clocking: High I/O count with adjustable slew control and family-level PLL resources make it easier to implement diverse interface standards and robust timing architectures.
• Proven ecosystem: Cyclone III family documentation and pre-built IP (including family support for the Nios II embedded processor) help accelerate development and reduce time to market.

Why Choose EP3C25F256I7N?

The EP3C25F256I7N positions itself as a practical choice for mid-density FPGA requirements where a balance of logic capacity, embedded memory, I/O density, and industrial temperature capability is required. Its Cyclone III family heritage emphasizes low-power operation and broad design flexibility, making it suitable for cost-sensitive, high-volume deployments as well as rugged industrial applications.

Designers benefit from on‑chip resources that reduce external BOM, a compact 256‑LBGA package for space-constrained PCBs, and family-level development assets that streamline implementation and verification.

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