EP3C25F324C6N

The EP3C25F324C6N is an Intel Cyclone® III family Field Programmable Gate Array (FPGA) in a 324-ball FBGA package designed for low-power, cost-sensitive designs. It provides a mid-range FPGA fabric with 24,624 logic elements, 608,256 bits of on-chip RAM, and 215 user I/Os to support complex glue-logic, protocol bridging, and embedded control tasks.

Built for commercial applications, this device targets high-volume, low-power systems such as portable/handheld devices, consumer electronics, and network or embedded-processing modules where integration, I/O flexibility, and energy efficiency matter. It operates from a core supply between 1.15 V and 1.25 V and is specified for 0 °C to 85 °C operation.

Key Features

• Logic Capacity  Provides 24,624 logic elements suitable for mid-range FPGA designs and system integration tasks.
• On-chip Memory  608,256 total RAM bits of embedded memory (approximately 0.61 Mbits) for buffering, packet storage, and local data processing.
• I/O Count & Flexibility  215 user I/Os delivered in a 324-FBGA (19×19) package to support diverse interfaces and board-level routing.
• Low-Power Operation  Part of the Cyclone III family optimized for low power consumption, helping extend battery life and reduce thermal management requirements.
• Clock Management  Family-level clocking features including multiple PLLs for flexible clock generation and distribution (see device handbook for details).
• Package & Mounting  324-BGA (324-FBGA, 19×19) surface-mount package for compact PCB integration and high I/O density.
• Commercial Temperature Grade  Specified for 0 °C to 85 °C operation and RoHS compliant for global assembly processes.
• Supply Voltage  Core voltage range specified from 1.15 V to 1.25 V to match common FPGA power rail designs.

Typical Applications

• Portable and Handheld Devices  Use the low-power Cyclone III architecture to extend battery life while integrating control logic and interfaces.
• Consumer Electronics  Provide display controllers, protocol bridging, and system glue logic where on-chip memory and moderate logic density streamline designs.
• Embedded Processing Modules  Implement custom datapaths, peripheral interfaces, and lightweight embedded processors leveraging on-chip RAM and abundant I/Os.
• Communications & Networking  Handle packet buffering, protocol adaptation, and I/O aggregation in mid-range networking equipment and access devices.

Unique Advantages

• Balanced Logic and Memory  24,624 logic elements combined with 608,256 bits of RAM enable compact integration of control, buffering, and data-path functions on a single device.
• High I/O Density in a Compact Package  215 I/Os in a 324-FBGA (19×19) package reduce board complexity and simplify routing for multi-interface systems.
• Low-Power Family Benefits  Designed as part of a low-power FPGA family to help reduce system-level power and cooling requirements.
• Commercial Grade and RoHS Compliant  Specified for 0 °C to 85 °C operation and RoHS compliant to meet common commercial product and assembly standards.
• Flexible Clock and I/O Capabilities  Cyclone III family clocking and I/O features enable robust timing control and support for a wide range of interface requirements (refer to device handbook for supported I/O standards).
• Surface-Mount Integration  Surface-mount 324-BGA package supports compact, manufacturable PCB designs for high-volume production.

Why Choose EP3C25F324C6N?

The EP3C25F324C6N positions itself as a practical mid-range FPGA choice where a combination of logic capacity, embedded memory, and high I/O count is required without incurring the size and power of larger devices. Its Cyclone III family heritage emphasizes low-power operation and system integration, making it suitable for designers who need to consolidate functions and reduce BOM complexity in commercial products.

For teams optimizing for board area, I/O density, and power, this device offers a clear balance of resources and manufacturability—backed by Cyclone III device documentation, design flows, and pre-verified IP available in the device handbook to accelerate development and deployment.

Request a quote or submit a purchase inquiry to obtain pricing, availability, and lead-time information for the EP3C25F324C6N.