EP3C25F324C8N

The EP3C25F324C8N is a Cyclone® III family FPGA delivering mid-range logic capacity and on-chip memory in a compact 324-BGA package. It combines 24,624 logic elements, approximately 0.61 Mbits of embedded RAM and 215 general-purpose I/Os to address high-volume, low-power and cost-sensitive applications.

Built on the Cyclone III device family architecture, the device targets portable and handheld systems, consumer and communications equipment, and other designs where power efficiency, I/O density and integration are primary considerations.

Key Features

• Logic Capacity — 24,624 logic elements for implementing combinational and sequential logic, state machines, and custom datapaths.
• Embedded Memory — Approximately 0.61 Mbits of on-chip RAM to support buffers, FIFOs and small data stores without external memory.
• I/O Density — 215 I/O pins to support parallel interfaces, multiple peripherals and board-level connectivity in I/O-constrained designs.
• Low-Voltage Core — Core supply range of 1.15 V to 1.25 V to match system power domains and support low-power operation.
• Compact BGA Package — 324-ball BGA (324-FBGA, 19×19) surface-mount package for high pin-count in a small board footprint.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature suitable for general commercial applications.
• RoHS Compliant — Conforms to RoHS requirements for lead-free assemblies.
• Cyclone III Family Benefits — Leverages family-level features such as low-power TSMC process technology and device-level functions designed for reduced static power and efficient system integration.

Typical Applications

• Portable and Handheld Devices — Low-power operation and compact BGA packaging support battery-operated designs and space-constrained PCBs.
• Consumer Electronics — Provides logic and memory integration for display control, protocol bridging and peripheral aggregation in consumer products.
• Communications and Networking — 215 I/Os and flexible logic capacity enable protocol interfaces, packet processing offload and custom glue logic.
• Embedded Processing and Control — On-chip RAM and logic density support control tasks, finite-state machines and tightly coupled custom processors or soft-core implementations.

Unique Advantages

• Balanced Logic and Memory: 24,624 logic elements paired with approximately 0.61 Mbits of embedded RAM simplify mid-range designs without immediate need for external memory.
• High I/O Count in Small Footprint: 215 I/Os in a 324-BGA package reduce routing complexity while preserving board area for other components.
• Low-Voltage Core: 1.15 V–1.25 V supply range supports integration into modern low-power system architectures and helps minimize core power draw.
• Commercial Temperature Rating: Specified 0 °C to 85 °C operation aligns with mainstream electronics and consumer product requirements.
• Regulatory Compliance: RoHS compliance simplifies integration into lead-free manufacturing flows.
• Family-Level Power Optimizations: Benefits from Cyclone III low-power process and device optimizations to help meet system power budgets.

Why Choose EP3C25F324C8N?

The EP3C25F324C8N positions itself as a practical choice for designers who need a mid-range FPGA with a strong balance of logic density, embedded memory and high I/O count in a compact BGA package. Its commercial temperature rating and low-voltage core make it suitable for consumer, portable and communications applications where power efficiency and board real estate matter.

Choosing this Cyclone III device gives access to the family’s low-power architecture and a feature set tuned for integration—helping reduce system BOM and accelerate time-to-market for cost-sensitive designs.

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