EP3C25Q240C8N

The EP3C25Q240C8N is a Cyclone® III family field-programmable gate array (FPGA) in a 240‑pin BFQFP package, providing approximately 24,624 logic elements and roughly 0.608 Mbits of embedded memory. It targets cost- and power-sensitive commercial applications that require a balance of logic capacity, on-chip memory, and a high I/O count.

Built on the Cyclone III device family architecture, this device combines low-power silicon characteristics with system-level integration features such as multiple PLLs and flexible I/O support. The device operates from a 1.15–1.25 V core supply and is specified for commercial temperature operation from 0°C to 85°C.

Key Features

• Logic Capacity — Approximately 24,624 logic elements (LEs) enabling mid-range logic integration for control, protocol, and glue-logic functions.
• Embedded Memory — Approximately 608,256 bits of on-chip RAM to support buffering, FIFOs, and small data stores without external memory.
• I/O Count & Flexibility — 148 user I/Os to support parallel interfaces, sensor connections, and board-level signaling in I/O-constrained designs.
• Low-Power Family Characteristics — Cyclone III family emphasizes low static power and low-power process technology suitable for power-aware designs and thermally-challenged environments.
• Clock Management — Family-level support includes up to four phase-locked loops (PLLs) for robust clock generation, distribution, and dynamic reconfiguration in-system.
• Package & Mounting — 240‑BFQFP (supplier device package: 240‑PQFP, 32×32) in a surface-mount form factor for compact PCB layouts.
• Power & Operating Range — Core supply 1.15–1.25 V; specified commercial operating temperature range 0°C to 85°C.
• Regulatory — RoHS compliant.

Typical Applications

• Portable and Handheld Devices — Low-power family attributes support extended battery life and reduced cooling needs for compact products.
• Consumer and Commercial Electronics — Mid-range logic and embedded memory enable display control, user-interface management, and peripheral bridging.
• Communications and Connectivity — Multiple PLLs and a high I/O count facilitate clocking and interface handling for protocol conversion and I/O aggregation.
• Embedded Control and Instrumentation — On-chip RAM and plentiful I/Os support sensor interfacing, local processing, and timing-critical control tasks.

Unique Advantages

• Balanced Logic-to-Memory Ratio: Approximately 24,624 logic elements paired with ~0.608 Mbits of embedded RAM provides on-chip resources for mixed logic and buffering needs, reducing reliance on external memory.
• High I/O Density: 148 user I/Os accommodate multiple parallel interfaces and simplify board-level routing in I/O-constrained designs.
• Low-Power Silicon Characteristics: Cyclone III family optimizations and low-power process technology help lower static power consumption for energy-conscious designs.
• Robust Clocking Options: Family-level support for multiple PLLs allows flexible clock generation and dynamic reconfiguration for complex timing domains.
• Compact Surface-Mount Package: 240‑pin BFQFP in a 32×32 footprint supports compact PCB layouts while retaining ample I/O and routing accessibility.
• Commercial Temperature and RoHS Compliance: Device is specified for 0°C to 85°C operation and meets RoHS requirements for regulatory alignment.

Why Choose EP3C25Q240C8N?

The EP3C25Q240C8N offers a practical combination of mid-range logic density, embedded memory, and high I/O count in a compact surface-mount package. It is well suited to commercial designs that need a cost-effective, low-power FPGA platform with on-chip resources for control, interface, and buffering tasks.

Designed within the Cyclone III family, this device benefits from a family-level emphasis on low-power operation, flexible clock management, and system integration features. It fits projects that require scalability, solid vendor-backed device family features, and predictable commercial-grade environmental performance.

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