EP3C25U256A7N

The EP3C25U256A7N is a Cyclone® III family Field Programmable Gate Array (FPGA) offered in a 256‑LFBGA package. It provides 24,624 logic elements and approximately 0.61 Mbits of embedded memory in a low‑power FPGA architecture designed for cost‑sensitive and thermally challenging applications.

With an operating range of 1.15 V to 1.25 V, AEC‑Q100 qualification and an extended temperature rating of ‑40 °C to 125 °C, this device targets designs that require automotive‑grade qualification, flexible I/O, and on‑chip system integration while maintaining surface‑mount packaging for compact board implementations.

Key Features

• Logic Capacity — 24,624 logic elements to implement mid‑range FPGA designs and custom digital functions.
• Embedded Memory — 608,256 bits of on‑chip RAM (approximately 0.61 Mbits) to support buffers, FIFOs and local data storage.
• I/O Density — 156 user I/O pins for flexible interfacing with peripherals, sensors, and external devices.
• Low‑Voltage Core — Core supply range of 1.15 V to 1.25 V to align with low‑power system designs.
• Package and Mounting — 256‑LFBGA (supplier package: 256‑UBGA 14×14) in a surface‑mount form factor suitable for compact PCBs.
• Automotive Qualification — AEC‑Q100 qualification and operating temperature from ‑40 °C to 125 °C for automotive system integration.
• RoHS Compliant — Conforms to RoHS requirements for lead‑free manufacturing.
• Cyclone III Family Features — Family‑level capabilities such as low‑power silicon optimizations, multi‑standard I/O support, and integrated PLLs for clock management are available on Cyclone III devices.

Typical Applications

• Automotive Electronics — Implement sensor interfacing, gateway functions or peripheral control where AEC‑Q100 qualification and extended temperature range are required.
• Embedded Control — Mid‑range embedded logic and glue‑logic tasks that benefit from on‑chip memory and flexible I/O mapping.
• Industrial Systems — Control and data aggregation in thermally demanding environments that need a reliable, surface‑mount programmable device.

Unique Advantages

• Automotive‑grade Qualification: AEC‑Q100 qualification combined with a ‑40 °C to 125 °C operating range supports deployment in automotive systems.
• Balanced Logic and Memory: 24,624 logic elements paired with approximately 0.61 Mbits of embedded RAM provides a mid‑range resource mix for common FPGA tasks.
• Flexible I/O Count: 156 user I/Os allow integration with multiple peripherals without external expander chips, simplifying board-level design.
• Compact, Surface‑Mount Package: The 256‑LFBGA footprint (256‑UBGA 14×14) enables high‑density PCB layouts for space‑constrained applications.
• Low‑Voltage Operation: 1.15 V–1.25 V core supply supports low‑power system architectures and aligns with modern power domains.
• Standards and Ecosystem: Being part of the Cyclone III family provides access to family‑level features and design resources documented for Cyclone III devices.

Why Choose EP3C25U256A7N?

The EP3C25U256A7N combines mid‑range logic capacity, on‑chip memory, and a high I/O count in a qualified automotive package, delivering a programmable solution for applications that require both robustness and integration. Its low‑voltage core and surface‑mount 256‑LFBGA package make it suitable for compact, thermally constrained designs.

Designed for engineers who need a validated, Cyclone III family FPGA with automotive qualification, this device is positioned for embedded control, automotive electronic subsystems, and industrial applications where long‑term availability and family ecosystem support matter.

Request a quote or submit an RFQ to obtain pricing and availability for EP3C25U256A7N. Our team can provide lead‑time and packaging information to support your design schedule.