EP3C25U256C7N

The EP3C25U256C7N is a Cyclone® III field programmable gate array (FPGA) optimized for low-power, high-functionality applications. Built on the Cyclone III device family architecture, it delivers a balance of logic capacity, embedded memory and I/O resources for high-volume, cost-sensitive and battery-powered designs.

This commercial-grade device is well suited to designs that require moderate logic density, flexible I/O and on-chip memory while operating within a 0 °C to 85 °C temperature range and a 1.15 V to 1.25 V supply domain.

Key Features

• Logic Capacity  24,624 logic elements provide substantial programmable logic for mid-range designs and IP integration.
• Embedded Memory  Approximately 0.61 Mbits of on-chip RAM (608,256 bits) for buffering, state machines and small data stores.
• I/O Resources  156 user I/O pins delivered in a 256-LFBGA package, enabling diverse external interface connectivity.
• Clock Management  Four phase-locked loops (PLLs) per device with five outputs per PLL, supporting cascaded and dynamically reconfigurable clocking topologies.
• Low-Power Architecture  Cyclone III family features target low static power through TSMC low-power process technology and power-aware design flow.
• System Reliability Features  Family-level reliability elements include dedicated CRC/checker circuitry to detect single-event upset (SEU) conditions and support remote system upgrades without external controllers.
• Power and Supply  Device operates from a 1.15 V to 1.25 V supply range, suitable for designs targeting low-voltage FPGA integration.
• Package and Mounting  256-LFBGA (supplier package: 256-UBGA, 14×14 mm) in a surface-mount form factor for compact PCB implementations.
• Commercial Temperature Range  Rated for 0 °C to 85 °C operation for typical commercial applications.

Typical Applications

• Portable and Battery-Powered Devices  Low-power architecture and compact package make the device suitable for handheld and battery-conscious designs.
• High-Volume, Cost-Sensitive Electronics  Balanced logic density and memory resources provide a cost-effective platform for mass-produced consumer and embedded products.
• Interface and I/O Bridging  156 I/O pins and family support for multiple I/O standards enable protocol bridging, SERDES-less interface logic and peripheral aggregation.
• Embedded Control and Sequencing  On-chip RAM and programmable logic capacity support finite-state machines, control logic and integration of soft IP cores for embedded tasks.

Unique Advantages

• Balanced Mid-Range Capacity: 24,624 logic elements and ~0.61 Mbits of embedded memory provide a strong balance of resources without the cost or power of higher-density devices.
• Flexible Clocking: Four PLLs with multiple outputs allow robust clock management and local synthesis for diverse timing domains.
• Low-Voltage Operation: Narrow supply window (1.15–1.25 V) supports low-voltage system designs and power-optimized deployments.
• Compact, Surface-Mount Packaging: 256-LFBGA (14×14 mm UBGA variant) eases PCB area planning while offering high I/O density.
• Commercial Reliability: Rated for 0 °C to 85 °C operation and includes family-level SEU detection mechanisms to improve design robustness.

Why Choose EP3C25U256C7N?

The EP3C25U256C7N positions itself as a practical Cyclone III FPGA option for designers who need mid-range logic capacity, reliable embedded memory and substantial I/O in a low-power, low-voltage platform. Its combination of 24,624 logic elements, approximately 0.61 Mbits of on-chip RAM and four PLLs makes it a versatile choice for consumer, embedded and other commercial applications where cost, power and integration are important.

Choosing this device provides straightforward scalability within the Cyclone III family and leverages family-level features such as configurable clock management and SEU detection to support stable, maintainable designs over product lifecycles.

Request a quote or submit a purchase inquiry to check availability and pricing for EP3C25U256C7N today.