EP3C25U256I7

The EP3C25U256I7 is a Cyclone® III family Field Programmable Gate Array (FPGA) offered in a 256-LFBGA package. It provides 24,624 logic elements, approximately 0.61 Mbits of embedded memory, and 156 user I/Os—making it suitable for industrial and embedded designs that require mid-range logic capacity with flexible I/O and on-chip memory.

Built on the Cyclone III device family architecture, this device targets low-power, cost-sensitive applications while offering system-level integration features from the family handbook such as configurable I/O standards, robust clock management, and on-chip memory resources.

Key Features

• Logic Capacity  24,624 logic elements providing mid-range programmable logic suitable for complex glue logic, protocol handling, and control functions.
• Embedded Memory  Approximately 0.61 Mbits of on-chip RAM for buffers, FIFOs, and small data-storage needs.
• I/O Count & Flexibility  156 I/O pins in a 256-LFBGA (supplier package 256-UBGA, 14×14) footprint, allowing broad signal interfacing and peripheral connectivity.
• Power Supply  Core voltage range of 1.15 V to 1.25 V to support low-power operation and predictable power budgeting.
• Clock Management (Family Feature)  Cyclone III family devices include advanced clock-management resources such as multiple phase-locked loops (PLLs) for clock synthesis and distribution.
• Package & Mounting  256-LFBGA surface-mount package (supplier device package: 256-UBGA, 14×14) for compact PCB integration.
• Industrial Temperature Grade  Specified operating range from −40 °C to 100 °C to meet industrial-environment requirements.
• Regulatory Compliance  RoHS-compliant construction for environmental and manufacturing compatibility.

Typical Applications

• Industrial Control  Implement motor control logic, sensor aggregation, and deterministic I/O handling using the device’s logic and I/O resources within an industrial temperature range.
• Embedded Processing & Glue Logic  Offload protocol handling, bus bridging, or custom peripheral control with available embedded memory and sizable logic element count.
• Communications & Networking  Support mid-range packet handling, serializer/deserializer interfacing, and custom protocol engines leveraging flexible I/O and on-chip memory.
• Consumer & Portable Systems  Use as a low-power programmable fabric for display controllers, interface bridging, or system-peripheral coordination in cost-sensitive designs.

Unique Advantages

• Balanced Logic and Memory:  24,624 logic elements paired with approximately 0.61 Mbits of embedded RAM enables efficient partitioning of logic and data storage within a single device.
• High I/O Density in a Compact Package:  156 user I/Os in a 256-LFBGA package simplify board-level routing while preserving signal access for diverse peripherals.
• Industrial-Grade Temperature Range:  Rated from −40 °C to 100 °C for reliable operation in a wide range of factory and field environments.
• Low-Voltage Core:  1.15 V to 1.25 V supply range supports low-power designs and predictable power planning at the system level.
• Family-Level Integration Features:  Cyclone III family capabilities such as multiple PLLs and configurable I/O standards reduce the need for additional components and simplify system design.
• RoHS Compliance:  Environmentally compliant manufacturing streamlines regulatory acceptance and downstream assembly.

Why Choose EP3C25U256I7?

The EP3C25U256I7 combines substantial mid-range programmable logic, embedded memory, and a high I/O count in a compact 256-LFBGA footprint, packaged for industrial-temperature operation. It is well suited to engineers who need a cost-conscious, low-power FPGA platform with the system integration features of the Cyclone III family.

This device addresses designs that demand reliable operation across temperature extremes, flexible interfacing, and on-chip resources sufficient for control, protocol, and integration tasks—delivering long-term value through scalability within the Cyclone III family.

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