EP3C40F324A7N

The EP3C40F324A7N is a Cyclone® III family field programmable gate array (FPGA) offered in a 324‑ball BGA package. It delivers 39,600 logic elements and approximately 1.16 Mbits of embedded memory in a surface‑mount, automotive‑grade device qualified to AEC‑Q100.

Designed for cost‑ and power‑sensitive designs, this device is suited to applications requiring a high I/O count and extended operating temperature range while maintaining low core voltage operation (1.15–1.25 V).

Key Features

• Logic Capacity — 39,600 logic elements provide significant gate density for mid‑range FPGA designs and custom logic implementation.
• Embedded Memory — Approximately 1.16 Mbits of on‑chip RAM to support buffer, FIFO, and memory‑mapped logic needs.
• I/O Resources — 195 user I/O pins enable broad external interface support and high connectivity for sensors, peripherals, and system buses.
• Power Supply — Core voltage range of 1.15 V to 1.25 V for low‑power operation consistent with Cyclone III family optimizations.
• Automotive Qualification — AEC‑Q100 qualification and automotive grade designation for designs that require automotive reliability and stress testing.
• Package & Mounting — 324‑BGA (supplier package: 324‑FBGA, 19×19) in a surface‑mount form factor for compact PCB integration.
• Extended Temperature Range — Rated for –40°C to 125°C operation, supporting thermally demanding and automotive environments.
• RoHS Compliant — Meets RoHS requirements for lead‑free assembly and modern environmental standards.
• Cyclone III Family Advantages — Built on Cyclone III low‑power architecture offering family‑level features such as low static power and a rich set of device‑level integrations for cost‑sensitive, low‑power systems.

Typical Applications

• Automotive Systems — AEC‑Q100 qualification and –40°C to 125°C rating make it suitable for in‑vehicle control, sensor aggregation, and body‑electronics functions.
• Portable and Low‑Power Devices — Cyclone III low‑power architecture and 1.15–1.25 V core operation help extend battery life and reduce thermal management needs.
• I/O‑Rich Interfaces — 195 I/O pins support complex sensor arrays, human‑machine interfaces, and peripheral bridging where many external signals are required.
• Embedded Memory‑Centric Logic — Approximately 1.16 Mbits of RAM make this FPGA a fit for buffering, packet processing, and mid‑range memory requirements without external RAM.

Unique Advantages

• Automotive‑grade reliability: AEC‑Q100 qualification and wide temperature rating provide traceable assurance for automotive and harsh‑environment applications.
• Substantial logic and memory in a compact package: 39,600 logic elements and ~1.16 Mbits of embedded memory in a 324‑FBGA (19×19) minimize board area while supporting mid‑range designs.
• High I/O count: 195 user I/Os reduce the need for external interface multiplexers, simplifying PCB routing and BOM.
• Low core voltage operation: 1.15–1.25 V supply supports low power budgets and aligns with low‑power system designs.
• RoHS compliance: Facilitates environmentally compliant manufacturing and deployment.

Why Choose EP3C40F324A7N?

The EP3C40F324A7N combines Cyclone III family efficiency with automotive qualification to deliver a mid‑range FPGA option for designers who need a balance of logic capacity, embedded memory, and high I/O in a compact surface‑mount package. Its extended temperature range and AEC‑Q100 status make it appropriate for applications that demand reliability across harsh operating conditions.

This device is well suited for teams developing cost‑sensitive, low‑power systems that require on‑chip memory and significant I/O density without sacrificing automotive‑level qualification and environmental compliance.

Request a quote or submit a pricing inquiry for EP3C40F324A7N to evaluate availability and delivery for your next design.