EP3C40F324C7N

The EP3C40F324C7N is a Cyclone III family field-programmable gate array (FPGA) optimized for high-functionality, low-power, cost-sensitive designs. This commercial-grade, surface-mount device provides 39,600 logic elements and approximately 1.16 Mbits of embedded memory, making it suitable for dense logic integration and mid-range embedded memory needs.

With a 324-ball BGA package and 195 user I/Os, the device targets high-volume consumer and communications applications that require flexible I/O, efficient clock management, and low-voltage operation (1.15 V to 1.25 V) across a commercial temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity  39,600 logic elements provide substantial programmable logic resources for glue logic, protocol adaptation, and custom datapaths.
• Embedded Memory  Approximately 1.16 Mbits of on-chip RAM to support buffering, FIFOs, and small embedded data structures without external memory.
• I/O Count & Flexibility  195 user I/Os in a 324-BGA package support diverse signaling and board-level routing for complex interfaces.
• Low-Voltage Operation  Core supply range of 1.15 V to 1.25 V for reduced power draw in battery-influenced or thermally constrained designs.
• Package & Mounting  324-BGA (supplier package: 324-FBGA, 19×19) surface-mount package for compact PCB footprint and high pin density.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, suitable for mainstream consumer and communications equipment.
• Family-Level System Features  Cyclone III family includes low-power process optimizations, multiple PLLs for clock synthesis/management, and a library of supported IP cores and design tools to accelerate development.
• Regulatory  RoHS compliant.

Typical Applications

• Consumer Electronics: Control logic, peripheral bridging, and user-interface controllers where low power and compact packaging matter.
• Communications & Networking: Mid-range protocol handling, packet buffering, and interface conversion using available I/O bandwidth and embedded RAM.
• Portable & Handheld Devices: Low-power architecture enables extended battery life and operation in thermally constrained enclosures.
• Prototyping & Embedded Systems: Flexible logic resources and supported IP cores allow rapid hardware prototyping and custom embedded solutions.

Unique Advantages

• Significant Logic Density: 39,600 logic elements give designers room to implement complex control, state machines, and data-path logic without immediately requiring larger devices.
• Integrated On-Chip Memory: Approximately 1.16 Mbits of embedded RAM reduces reliance on external memory for common buffering and storage tasks, simplifying BOM and layout.
• High Pin Count in Compact Package: 195 I/Os in a 324-BGA (19×19) package enable multiple high-density interfaces while keeping PCB area low.
• Low-Power Silicon Optimizations: Cyclone III family design and process choices target reduced static power, helping meet power budgets for portable and high-volume products.
• Robust Clocking Options: Family features include multiple PLLs for flexible clock management, supporting precise timing and multiple clock domains.
• Commercial Availability & Compliance: Commercial-grade temperature rating and RoHS compliance align with mainstream manufacturing and environmental requirements.

Why Choose EP3C40F324C7N?

The EP3C40F324C7N delivers a balanced combination of logic capacity, embedded memory, and I/O density in a low-voltage, commercial-grade Cyclone III device. It is well suited for teams building cost-sensitive, high-volume consumer and communications products that require programmable logic, moderate on-chip RAM, and compact board-level integration.

Choosing this part provides a clear upgrade path within the Cyclone III family and access to family-level design tools and IP, enabling faster development cycles and long-term design scalability.

If you would like pricing or availability, request a quote or submit a purchase inquiry to receive a tailored response for your project requirements.