EP3C40F324C8

The EP3C40F324C8 is a Cyclone® III field programmable gate array (FPGA) offered in a 324-ball FBGA (19×19) package. It delivers a mid-range FPGA fabric with 39,600 logic elements, approximately 1.16 Mbits of embedded memory, and 195 user I/Os for integration into compact, cost-sensitive designs.

Built on the Cyclone III device family, this device targets high-volume, low-power applications where integration, predictable power, and flexible I/O are priorities. The device is commercial grade with a 0 °C to 85 °C operating range and RoHS compliance.

Key Features

• Logic Capacity — 39,600 logic elements (LEs) to implement mid-range digital logic and control functions.
• On‑Chip Memory — Approximately 1.16 Mbits of embedded RAM for local buffering, state storage, and packet/stream handling.
• I/O Density — 195 user I/Os to support diverse peripheral and bus interfaces.
• Power and Supply — Core voltage supply range 1.15 V to 1.25 V to support predictable power budgeting.
• Clock Management — Cyclone III family features include up to four PLLs per device for flexible clock synthesis and distribution.
• Package & Mounting — 324-FBGA (19×19) surface-mount package (324-BGA), providing a compact footprint for board-level integration.
• Operating Range & Grade — Commercial grade device with operating temperature 0 °C to 85 °C.
• Standards & Integration — Cyclone III family supports a wide set of I/O standards and on-chip capabilities to simplify system integration.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Battery-powered and portable devices — Low-power family design helps extend battery life in handheld and portable products that require programmable logic.
• Consumer electronics — Mid-range logic capacity and high I/O count support user interface control, media bridging, and peripheral aggregation.
• Communications and networking — On-chip RAM and abundant I/Os enable buffering and protocol interfacing in compact network modules.
• Embedded control and custom logic — Sufficient logic and memory for motor control, sensor aggregation, and system glue logic in cost-sensitive designs.

Unique Advantages

• Highly integrated mid-range FPGA: 39,600 logic elements and approximately 1.16 Mbits of embedded memory reduce the need for external components and simplify PCB design.
• High I/O count: 195 user I/Os provide flexibility for multiple interfaces and peripheral connections without external multiplexing.
• Predictable power envelope: Narrow core supply range (1.15 V to 1.25 V) supports consistent power planning for system-level thermal and power design.
• Compact package: 324-FBGA (19×19) surface-mount package enables dense board layouts in space-constrained applications.
• Family-level low-power features: Cyclone III family architecture and low-power process characteristics support lower static power consumption for volume designs.
• RoHS compliant: Meets common environmental requirements for modern electronics manufacturing.

Why Choose EP3C40F324C8?

The EP3C40F324C8 provides an effective balance of logic capacity, embedded memory, and I/O density in a compact FBGA package for commercial designs that prioritize power efficiency and integration. As part of the Cyclone III family, it benefits from family-level features aimed at low power and flexible clock management, making it suitable for cost-sensitive, high-volume products.

Designers seeking a mid-range FPGA solution for portable devices, consumer electronics, communications modules, or embedded control systems will find the EP3C40F324C8 a practical choice that simplifies BOM and supports compact board layouts while meeting commercial temperature and RoHS requirements.

If you would like pricing, availability, or to request a quote for EP3C40F324C8, submit a quote or contact sales for further assistance.