EP3C40F484A7N

The EP3C40F484A7N is a Cyclone® III family field-programmable gate array (FPGA) optimized for low-power, cost-sensitive designs. It delivers medium-density programmable logic with approximately 1.16 Mbits of embedded memory and 331 user I/Os in a compact 484‑FBGA (23 × 23) surface-mount package.

Qualified to AEC‑Q100 and rated for operation from ‑40 °C to 125 °C, this device is suited for applications that require automotive-grade qualification and robust thermal performance while retaining the flexibility and system integration benefits of the Cyclone III device family.

Key Features

• Logic Capacity  Provides 39,600 logic elements for implementing medium-complexity digital functions and control logic.
• Embedded Memory  Approximately 1.16 Mbits of on-chip RAM to support frame buffers, FIFOs, and fast local storage.
• I/O Density & Flexibility  331 general-purpose I/Os in a high-count BGA footprint for dense external interfacing and routing on compact PCBs.
• Power and Voltage  Core supply range of 1.15 V to 1.25 V consistent with low-power Cyclone III process optimizations.
• Clock Management  Cyclone III family devices include multiple PLLs for flexible clock synthesis and distribution to support complex timing domains.
• Automotive Qualification  AEC‑Q100 qualified and specified for an operating range of ‑40 °C to 125 °C for automotive-grade system deployment.
• Package & Mounting  484‑FBGA (23 × 23) surface-mount package for high I/O count in a compact footprint; RoHS compliant.
• System Integration  Cyclone III device family features high memory-to-logic and multiplier-to-logic ratios and a broad set of supported I/O standards to simplify system design.

Typical Applications

• Automotive control and body electronics  AEC‑Q100 qualification and extended temperature range enable deployment in control modules and vehicle subsystems.
• Sensor interfacing and data aggregation  High I/O count and on-chip memory support aggregation and preprocessing of sensor data before passing to higher-level systems.
• Embedded signal processing  Ample logic elements and embedded RAM enable medium-complexity signal processing, filtering, and protocol handling.
• Compact, high-density boards  The 484‑FBGA package and surface-mount mounting fit space-constrained PCB designs while preserving routing capacity for dense I/O.

Unique Advantages

• Automotive-ready qualification: AEC‑Q100 certification and a −40 °C to 125 °C operating range reduce qualification effort for automotive applications.
• Balanced logic and memory: 39,600 logic elements paired with approximately 1.16 Mbits of embedded RAM provide a balanced platform for control and buffering tasks.
• High I/O capacity: 331 user I/Os support multiple external interfaces and sensor networks without requiring external GPIO expanders.
• Low-power family architecture: Based on the Cyclone III low-power device family, the part benefits from process and architecture optimizations that help meet power budgets.
• Compact, manufacturable package: 484‑FBGA (23 × 23) surface-mount package offers a high-pin-count solution with industry-standard assembly flow and RoHS compliance.
• Family-level ecosystem: Access to Cyclone III family features such as PLL-based clock management and pre-validated IP enables faster integration and development.

Why Choose EP3C40F484A7N?

The EP3C40F484A7N combines medium-density programmable logic, sizable embedded memory, and a high I/O count in an automotive-qualified Cyclone III package. It is well suited to designs that require reliable operation across wide temperature ranges and the flexibility of FPGA-based implementation while maintaining a compact board footprint.

Choose this device when you need a qualified, production-friendly FPGA platform that aligns with Cyclone III family capabilities—enabling system integration, flexible clocking, and on-chip resources to accelerate development and reduce bill of materials.

Request a quote or submit a procurement inquiry to begin sourcing the EP3C40F484A7N for your next design.