EP3C40F484C6N

The EP3C40F484C6N is a Cyclone III family FPGA in a 484‑ball FBGA (23×23) surface‑mount package. It delivers mid‑range programmable logic and on‑chip memory suitable for high‑volume, low‑power, cost‑sensitive designs.

With 39,600 logic elements, approximately 1.16 Mbits of embedded memory, and 331 I/O pins, this commercial‑grade device is designed for applications requiring moderate logic density, flexible I/O, and low static power operation within a 0 °C to 85 °C operating range and a 1.15–1.25 V supply.

Key Features

• Core & Logic 39,600 logic elements provide a mid‑range programmable fabric for custom logic, glue logic, and state machines.
• Embedded Memory Approximately 1.16 Mbits of on‑chip RAM supports buffering, FIFO, and small data‑store requirements without external memory.
• I/O Capacity 331 user I/O pins enable interfacing to multiple peripherals and buses from a single device.
• Power and Process Built on the Cyclone III low‑power device family, optimized for reduced static power consumption; nominal core supply 1.15–1.25 V.
• Clock Management Cyclone III family devices include flexible PLL resources for clock synthesis and distribution (family‑level feature set).
• Package & Mounting 484‑FBGA package (23×23) in a surface‑mount form factor suitable for compact PCB designs.
• Operating Range & Compliance Commercial grade operation from 0 °C to 85 °C and RoHS‑compliant manufacturing.
• I/O Standards (family capability) Cyclone III devices support a wide range of I/O standards including LVTTL, LVCMOS, SSTL, HSTL, PCI/PCI‑X, LVPECL, BLVDS, LVDS, mini‑LVDS, RSDS, and PPDS.

Typical Applications

• Portable and Handheld Devices Low static power and compact FBGA packaging make the device appropriate for battery‑sensitive, space‑constrained products.
• Consumer and PC Peripherals Use for protocol bridging, logic control, and I/O expansion where moderate logic density and many I/Os are required.
• Embedded Control and Interfaces Implement custom control logic, sensor interfacing, and data buffering leveraging on‑chip RAM and plentiful I/O.
• Communications and Connectivity Mid‑range logic and family clocking resources support interface adaptation, data paths, and timing management in networking modules.

Unique Advantages

• Balanced Logic and Memory: 39,600 logic elements paired with approximately 1.16 Mbits of embedded RAM reduce reliance on external components for many mid‑range designs.
• High I/O Count: 331 user I/Os simplify board‑level integration by accommodating multiple peripherals and interfaces directly on the FPGA.
• Low‑Power Family Design: Cyclone III family optimizations for low static power help extend battery life and lower cooling requirements in deployed systems.
• Compact, Surface‑Mount Package: 484‑FBGA (23×23) enables dense PCB layouts and space savings in compact electronic products.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation for standard commercial applications and environments.
• RoHS Compliant: Conforms to RoHS requirements for lead‑free manufacturing and regulatory compliance in many markets.

Why Choose EP3C40F484C6N?

The EP3C40F484C6N positions itself as a practical mid‑range FPGA choice for designers who need a combination of substantial logic capacity, meaningful on‑chip memory, and a high I/O count in a compact, surface‑mount package. Its Cyclone III family heritage brings low‑power process optimizations and family‑level features such as flexible clock management and broad I/O standard support.

This device fits customers building cost‑sensitive, high‑volume products—particularly portable, consumer, and embedded control applications—that benefit from integrating logic and memory on a single chip while maintaining predictable commercial temperature and supply requirements.

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