EP3C40F484C8N

The EP3C40F484C8N is an Intel Cyclone® III field programmable gate array (FPGA) optimized for low-power, high-functionality applications. As a member of the Cyclone III device family, it targets high-volume, cost-sensitive designs that require substantial logic capacity, on-chip memory, and flexible I/O.

This device integrates 39,600 logic elements, approximately 1.16 Mbits of embedded memory, and 331 user I/Os in a compact 484-BGA package, delivering a balance of integration, I/O density, and power efficiency for embedded and communications-focused applications.

Key Features

• Logic Capacity — 39,600 logic elements provide broad programmable logic resources for glue logic, protocol bridges, and custom accelerators.
• Embedded Memory — Approximately 1.16 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory.
• I/O Density — 331 user I/Os accommodate high-pin-count interfaces and multiple parallel buses in a single device.
• Clock Management — Cyclone III family features such as multiple phase-locked loops (PLLs) enable robust clock synthesis and distribution for multi-domain designs.
• Low-Voltage Core — Core supply range of 1.15 V to 1.25 V to match low-power system rails.
• Package & Mounting — Surface-mount 484-BGA (484-FBGA, 23×23) package provides high routing density and a compact footprint for space-constrained PCBs.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for mainstream commercial applications.
• RoHS Compliant — Conforms to RoHS environmental requirements for lead-free manufacturing.

Typical Applications

• Portable and battery-powered systems — Low-power family characteristics help extend battery life and reduce thermal management in handheld and portable devices.
• Embedded control and processing — On-chip logic and approximately 1.16 Mbits of RAM enable local processing, protocol handling, and control tasks.
• Communications and data interfaces — High I/O count and integrated clock resources support multi-channel interfaces, protocol bridging, and data path implementations.

Unique Advantages

• Highly integrated solution: Combines 39,600 logic elements, embedded memory, and 331 I/Os in a single package to reduce board-level BOM and simplify system design.
• Low-voltage core: 1.15 V–1.25 V supply supports modern low-power system rails and helps minimize overall power consumption.
• Compact, high-density packaging: 484-BGA (484-FBGA, 23×23) allows for dense routing and a small PCB footprint without sacrificing I/O count.
• Commercial operating range: Rated 0 °C to 85 °C for mainstream consumer and commercial applications where standard temperature operation is required.
• Environmentally compliant: RoHS status ensures compatibility with lead-free assembly and regulatory requirements.

Why Choose EP3C40F484C8N?

The EP3C40F484C8N positions itself as a practical choice for designers who need a balance of programmable logic, embedded memory, and high I/O density in a low-power Cyclone III device family offering. Its combination of 39,600 logic elements, approximately 1.16 Mbits of on-chip RAM, and 331 I/Os in a compact 484-BGA package supports a wide range of embedded and communications applications while keeping board complexity and power budgets in check.

For teams building high-volume, cost-sensitive products that require reliable vendor-supported FPGA technology and a proven device family feature set, the EP3C40F484C8N provides a solution that scales with design needs and integrates readily into commercial designs.

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