EP3C40F780C6
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 535 1161216 39600 780-BGA |
|---|---|
| Quantity | 1,013 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BGA | Number of I/O | 535 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2475 | Number of Logic Elements/Cells | 39600 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1161216 |
Overview of EP3C40F780C6 – Cyclone® III FPGA, 39,600 Logic Elements, 780‑BGA
The EP3C40F780C6 is a Cyclone® III family Field Programmable Gate Array (FPGA) in a 780‑ball FBGA package designed for cost‑ and power‑sensitive commercial applications. It combines 39,600 logic elements with approximately 1.16 Mbits of embedded memory and 535 user I/Os to support complex digital integration and high‑I/O system interfaces.
Built on the Cyclone III device family architecture, this device targets high‑integration use cases that require low static power, flexible clocking and diverse I/O support while maintaining a compact surface‑mount footprint.
Key Features
- Logic Density — 39,600 logic elements for implementing medium‑complexity digital designs and system functions.
- Embedded Memory — Approximately 1.16 Mbits of on‑chip RAM to support buffering, data paths and local storage.
- High I/O Count — 535 user I/Os to accommodate wide parallel interfaces and multi‑channel connectivity.
- Power and Supply — Operates from a core voltage of 1.15 V to 1.25 V; part of the Cyclone III family noted for low‑power operation to help meet tight power budgets.
- Clock Management — Family‑level clock resources include four phase‑locked loops (PLLs) per device, each with up to five outputs; PLLs are cascadable and dynamically reconfigurable to support flexible clock synthesis.
- I/O Standards and Signal Integrity — Cyclone III family supports a wide range of I/O standards (including LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI‑X, LVDS and others) and adjustable I/O slew rates to help manage signal integrity.
- Package & Mounting — 780‑ball FBGA (29 × 29) surface‑mount package (780‑BGA supplier device package) for compact board integration.
- Temperature & Grade — Commercial grade device with an operating range of 0 °C to 85 °C.
- Compliance — RoHS‑compliant for regulatory and environmental compatibility.
- System Reliability & Integration — Cyclone III family includes features for system health and reliability, such as dedicated CRC/checker circuitry and support for embedded processing (Nios II) and a broad collection of verified IP cores.
Typical Applications
- Consumer and Handheld Devices — Implement custom control logic, user interfaces and data processing while meeting low static power requirements.
- Communications and Networking — Aggregate multiple I/O channels and implement mid‑range packet processing, protocol bridging or interface conversion using the high I/O count and on‑chip memory.
- Industrial Automation — Drive control, sensor aggregation and deterministic I/O handling in commercial automation systems that operate within the specified temperature range.
- Embedded Systems — Integrate custom accelerators, glue logic and local memory for embedded controllers leveraging available PLLs and embedded memory.
Unique Advantages
- Highly integrated logic and memory: 39,600 logic elements combined with ~1.16 Mbits of embedded RAM reduce external component count and simplify board design.
- High I/O density: 535 user I/Os let you route wide buses and multiple interfaces without external expander ICs, saving board space and BOM cost.
- Low‑power family characteristics: Cyclone III architecture targets low static power operation, helping extend battery life and reduce cooling requirements.
- Flexible clocking and timing: Four PLLs with multiple outputs and dynamic reconfiguration enable robust clock management and multiple synchronized domains.
- Broad interface support: Family support for many I/O standards and adjustable slew rates eases integration with diverse peripherals and signaling requirements.
- Compact, manufacturable package: 780‑FBGA (29×29) surface‑mount package provides a small footprint suitable for space‑constrained designs while meeting RoHS requirements.
Why Choose EP3C40F780C6?
The EP3C40F780C6 delivers a balanced combination of logic capacity, embedded memory and extensive I/O in a compact 780‑BGA package, making it well suited for commercial applications that require mid‑range FPGA resources with low static power. Its Cyclone III family heritage provides flexible clocking, broad I/O standard support and system‑level features that streamline integration and shorten development cycles.
This device is ideal for engineers designing cost‑ and power‑sensitive systems who need a scalable, reliable FPGA platform with strong vendor ecosystem support and a wide selection of verified IP and embedded processing options.
Request a quote or submit an inquiry for pricing and availability of the EP3C40F780C6 to evaluate this Cyclone III FPGA for your next design.

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