EP3C40F780C7

The EP3C40F780C7 is a Cyclone III family field-programmable gate array (FPGA) supplied in a 780-ball fine-pitch BGA (29×29) surface-mount package. This device integrates 39,600 logic elements with approximately 1.16 Mbits of embedded memory and 535 general-purpose I/Os to address low-power, high-functionality, cost-sensitive designs.

Built on the Cyclone III architecture, the device targets applications that require elevated I/O density, balanced logic-to-memory resources, and low static power operation within a commercial temperature range (0 °C to 85 °C). The device operates from a core supply range of 1.15 V to 1.25 V and is RoHS compliant.

Key Features

• Logic Capacity — 39,600 logic elements (LEs) organized across 2,475 LABs/CLBs to support medium-density FPGA designs.
• Embedded Memory — Approximately 1.16 Mbits of on-chip RAM for buffering, FIFOs, and small embedded data structures.
• I/O Density — 535 I/O pins to support wide parallel interfaces and multiple high-pin-count peripherals.
• Low-Voltage Core — Core supply range from 1.15 V to 1.25 V to match low-power system designs and enable efficient power budgeting.
• Package and Mounting — 780‑FBGA (29×29) ball-grid array in a surface-mount form factor for compact board integration.
• Operating Conditions — Commercial-grade operation from 0 °C to 85 °C for standard environment deployments.
• RoHS Compliance — Environmentally compliant materials and manufacturing.
• Cyclone III Family Attributes — Built on a low-power process with architecture and software features that emphasize reduced static power, system integration, and a library of pre-built IP for accelerated development.

Typical Applications

• Portable and Handheld Devices — Low static power characteristics and compact FBGA packaging help extend battery life and reduce system size for portable electronics.
• Consumer Electronics — High I/O count and on-chip memory enable interface bridging, display/control logic, and multimedia glue logic in consumer products.
• Communications and Networking — Dense I/O and flexible logic resources support protocol adaptation, packet processing, and interface aggregation in networking equipment.
• Embedded Processing and Control — Adequate logic and memory resources to implement custom control, signal processing, and soft-core processor-based subsystems.

Unique Advantages

• Balanced Logic-to-Memory Ratio: 39,600 logic elements paired with ~1.16 Mbits of embedded RAM provide a flexible platform for mixed compute and buffering tasks.
• High I/O Capacity: 535 user I/Os reduce the need for external multiplexing, simplifying PCB routing for complex interface requirements.
• Compact, Surface-Mount Package: 780-FBGA (29×29) enables high-density board designs while maintaining reliable soldered connections.
• Low-Voltage Operation: Narrow core supply range (1.15–1.25 V) supports tight power budgets and predictable power delivery design.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C, suitable for standard commercial applications and environments.
• Ecosystem and Family-Level Tools: Based on the Cyclone III device family, the device benefits from family features and available pre-built IP to accelerate development and reduce time to market.

Why Choose EP3C40F780C7?

The EP3C40F780C7 provides a practical balance of logic capacity, embedded memory, and exceptional I/O density in a compact 780‑FBGA package. Its Cyclone III family architecture emphasizes low static power and system integration, making it well suited for cost- and power-sensitive designs that still require substantial I/O and on-chip resources.

This device is a strong option for design teams seeking a commercially rated FPGA that integrates medium-density logic and memory with a mature family-level toolset and IP library to shorten development cycles and streamline system integration.

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