EP3C40F780C8N

The EP3C40F780C8N is a Cyclone III family FPGA from Intel, delivered in a 780-ball BGA package with a 29 × 29 mm footprint. It provides programmable logic, embedded memory, and a high pin count for designs that require significant I/O and on-chip resources.

Targeted at cost- and power-sensitive commercial applications, this device combines approximately 39,600 logic elements with roughly 1.16 Mbits of embedded memory and 535 user I/Os to support system integration, interface bridging, and mid-range processing tasks.

Key Features

• Logic Capacity  Approximately 39,600 logic elements suitable for mid-range programmable designs.
• Embedded Memory  Total on-chip RAM of 1,161,216 bits (approximately 1.16 Mbits) for buffering, state storage, and local data processing.
• I/O Resources  535 user I/Os to support multiple interfaces, parallel buses, and high-pin-count connectivity.
• Power Supply Range  Core voltage support from 1.15 V to 1.25 V to match system power rails and design constraints.
• Package & Mounting  780-FBGA (29×29) package in a surface-mount format for compact PCB integration.
• Operating Temperature  Commercial-grade operating range from 0 °C to 85 °C for typical indoor and controlled-environment applications.
• RoHS Compliant  Meets RoHS requirements for environmental compliance.
• Cyclone III Family Capabilities  Built on the Cyclone III device family architecture, which emphasizes low power, high memory-to-logic ratio, high I/O count, and a collection of pre-verified IP cores for accelerated development.

Typical Applications

• Portable and Handheld Equipment  Low-power family characteristics and compact BGA packaging make the device suitable for battery-powered or space-constrained portable designs.
• Embedded Systems  On-chip memory and logic density support control, preprocessing, and glue-logic roles in embedded platforms.
• High‑I/O Interface Hubs  A large number of user I/Os enables bridging between multiple interfaces, sensor arrays, or parallel buses in mid-range systems.
• System Prototyping and Integration  Programmability and available Cyclone III IP cores simplify proof-of-concept and reduce development time for custom logic functions.

Unique Advantages

• Balanced Logic and Memory  Combines approximately 39,600 logic elements with about 1.16 Mbits of embedded RAM to handle both control logic and local data buffering on a single device.
• High Pin Count  535 user I/Os reduce the need for external I/O expanders and simplify board-level routing for multi-interface systems.
• Compact, Surface-Mount Packaging  780-FBGA (29×29) package enables dense board layouts while maintaining robust electrical connections.
• Commercial Temperature Range  Rated 0 °C to 85 °C to match a wide range of indoor and controlled-environment applications.
• RoHS Compliance  Meets environmental regulations for lead-free assembly and global supply chain requirements.
• Supported Family Ecosystem  Leverages the Cyclone III device family architecture and associated documentation and IP offerings for faster integration.

Why Choose EP3C40F780C8N?

The EP3C40F780C8N provides a practical combination of logic density, embedded memory, and a high I/O count in a commercial-grade, surface-mount BGA package. It is well suited for developers and procurement teams looking for a mid-range Cyclone III FPGA that supports integration of multiple interfaces and local data processing while remaining within typical commercial operating conditions.

Choosing this device offers designers the benefits of the Cyclone III family architecture—low-power optimizations, memory-to-logic balance, and an ecosystem of pre-verified IP—helping reduce development time and simplify system-level design decisions.

Request a quote or submit an inquiry to receive pricing and availability information for the EP3C40F780C8N and to discuss how it fits your design requirements.