EP3C40F780C7N

The EP3C40F780C7N is an Intel Cyclone III family Field Programmable Gate Array supplied in a 780‑ball FBGA (29×29) surface‑mount package. It delivers 39,600 logic elements and approximately 1.16 Mbits of embedded memory, targeting cost‑ and power‑sensitive commercial applications that require dense programmable logic, high I/O count, and compact packaging.

As a member of the Cyclone III device family, this device benefits from the family’s low‑power design focus and system integration features suitable for mid‑range, high‑I/O designs where power, board area and integration are important considerations.

Key Features

• Logic Capacity — 39,600 logic elements for implementing complex glue logic, protocol handling, and custom datapaths.
• Embedded Memory — Approximately 1.16 Mbits of on‑chip RAM to support FIFOs, buffers, and embedded data storage without external memory.
• I/O Density — 535 I/O pins to support wide parallel interfaces, multi‑lane links, and high pin‑count system connectivity.
• Package and Mounting — 780‑FBGA (29×29) surface‑mount package for compact board designs and high signal routing density.
• Power Supply Range — Core supply 1.15 V to 1.25 V, enabling predictable power planning for system design.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for standard commercial environments.
• RoHS Compliant — Meets RoHS requirements for lead‑free manufacturing.
• Cyclone III Family Features — Family‑level capabilities include low‑power process optimizations, multiple PLLs for clock management (four PLLs per device with five outputs per PLL), support for a wide set of I/O standards, and IP/processor integration options.

Typical Applications

• Industrial Control and Automation — Implement custom control logic, motor drive interfaces, and high‑speed I/O aggregation where compact packaging and programmable logic accelerate development.
• Communications and Networking — Use the device to handle parallel/serial interface bridging, protocol offload, and timing‑sensitive data paths leveraging high I/O count and on‑chip memory.
• Consumer and Embedded Systems — Integrate user interface control, sensor aggregation, and custom peripherals in space‑constrained designs benefiting from a dense FBGA package.
• Prototyping and FPGA‑based Subsystems — Rapidly iterate hardware functions, implement reference designs, and evaluate system partitions using the Cyclone III family architecture.

Unique Advantages

• High Logic and Memory Density: 39,600 logic elements paired with approximately 1.16 Mbits of embedded RAM reduce reliance on external components and simplify PCB layout.
• Extensive I/O: 535 I/O pins provide flexibility for interfacing with multiple peripherals and high‑pin‑count connectors without external multiplexing.
• Compact, Manufacturable Package: 780‑FBGA (29×29) surface‑mount packaging balances routing capability with a small board footprint for dense system designs.
• Power‑aware Family Design: Cyclone III family optimizations and low‑power process technology support lower standby and dynamic power for commercial applications.
• Robust Clocking and Integration: Family clock management features—including multiple PLLs with cascaded and reconfigurable outputs—support complex timing and multi‑domain designs.
• Regulatory Compliance: RoHS compliance simplifies integration into lead‑free manufacturing processes.

Why Choose EP3C40F780C7N?

The EP3C40F780C7N positions you to implement mid‑range to complex programmable logic functions with a balance of logic density, embedded memory and high I/O count in a compact 780‑FBGA package. Its Cyclone III family heritage brings power‑aware silicon design and system‑level features such as advanced clock management, enabling efficient, integrated solutions for commercial embedded and communications products.

Choose this device when your design requires a high‑I/O, high‑logic FPGA with on‑chip memory and predictable commercial temperature operation, backed by the Cyclone III device family architecture and ecosystem.

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