EP3C40F484I7N

The EP3C40F484I7N is an Intel Cyclone III family FPGA in a 484-ball BGA package, offering a balance of programmable logic capacity and on-chip memory for industrial applications. This device implements the Cyclone III architecture, targeting low-power, cost-sensitive designs that require moderate logic density, plentiful I/O, and on-chip RAM.

With 39,600 logic elements and approximately 1.161 Mbits of embedded memory, the EP3C40F484I7N supports a range of control, interface, and data-processing tasks while operating over an industrial temperature range and RoHS-compliant supply requirements.

Key Features

• Logic Capacity — 39,600 logic elements for implementing custom digital logic, state machines, and glue-logic functions.
• Embedded Memory — Approximately 1.161 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory.
• I/O Resources — 331 user I/O pins to accommodate a wide range of external interfaces and peripheral connections.
• Clock Management — Cyclone III family devices provide multiple PLLs for clock synthesis and distribution to support diverse timing domains (family-level feature).
• Power and Supply — Core voltage supply range of 1.15 V to 1.25 V to match system power rails and enable predictable power budgeting.
• Package and Mounting — 484-FBGA (23 × 23) package, surface-mount mounting type for compact PCB integration.
• Industrial Temperature Rating — Qualified for operation from −40 °C to 100 °C, suitable for industrial environments.
• Standards and Compliance — RoHS-compliant for environmental and regulatory compatibility.

Typical Applications

• Industrial Controls — Implement motor control logic, signal conditioning, and real-time I/O aggregation within temperature-challenged industrial systems.
• Communications Interfaces — Build protocol bridges, data packet handling, and interface converters using plentiful I/O and on-chip memory for buffering.
• Embedded System Glue and Pre‑/Post‑Processing — Offload deterministic control tasks, bus arbitration, and data formatting from a main processor to reduce system latency and BOM complexity.

Unique Advantages

• Substantial Logic Density: 39,600 logic elements provide the capacity to consolidate multiple functions into a single device and reduce board-level component count.
• On‑Chip Memory: Approximately 1.161 Mbits of embedded RAM enables local buffering and frame storage without immediate reliance on external memory.
• High I/O Count: 331 I/Os support extensive peripheral interfacing, sensor arrays, and multi-channel connectivity without multiplexing compromises.
• Industrial Reliability: −40 °C to 100 °C operating range and surface-mount BGA packaging facilitate deployment in industrial environments with tighter thermal requirements.
• Predictable Power Envelope: Defined core supply range (1.15–1.25 V) simplifies power-supply design and thermal planning.
• Regulatory Compatibility: RoHS compliance supports environmental and materials requirements for modern electronics production.

Why Choose EP3C40F484I7N?

The EP3C40F484I7N delivers a compelling mix of logic capacity, embedded memory, and extensive I/O in a compact 484-FBGA package tailored for industrial applications. Its Cyclone III family architecture provides low-power operation and family-level clocking and integration features that help designers consolidate functionality and simplify system design.

This device is well-suited for engineers building mid-density FPGA solutions where reliable operation across −40 °C to 100 °C, a predictable power supply range, and a high I/O count are priorities. It offers a practical path to reduce PCB complexity and BOM while leveraging the Cyclone III device family capabilities.

Request a quote or submit an inquiry to evaluate EP3C40F484I7N for your next design and get pricing and availability information tailored to your production requirements.