EP3C40F780C6N

The EP3C40F780C6N is a Cyclone III family FPGA delivering a balance of logic capacity, embedded memory, and high I/O count for cost- and power-sensitive designs. As a member of the Cyclone III device family, it leverages low-power TSMC process technology and silicon/software features that target high functionality with low static power.

This device suits applications that require substantial programmable logic (39,600 logic elements), approximately 1.16 Mbits of on-chip RAM, and up to 535 I/O pins in a compact 780-BGA footprint, while operating from a 1.15 V–1.25 V core supply and within a commercial temperature range (0 °C to 85 °C).

Key Features

• Core architecture (Cyclone III)  Low-power device family based on TSMC low-power process technology and power-aware design flow to minimize static power consumption.
• Logic capacity  39,600 logic elements suitable for mid-range programmable logic integration.
• Embedded memory  Approximately 1.16 Mbits of on-chip RAM to support buffering, state storage, and memory-mapped functions.
• I/O density and standards  Up to 535 user I/Os; the Cyclone III family supports a broad set of I/O standards including LVTTL, LVCMOS, SSTL, HSTL, PCI/PCI‑X, LVPECL, LVDS and related differential interfaces.
• Clock management  Four phase-locked loops (PLLs) per device with up to five outputs per PLL; cascaded and dynamically reconfigurable PLLs provide flexible clock synthesis and phase control.
• System integration  High memory-to-logic and multiplier-to-logic ratios and family support for embedded processing (Nios II) enable greater on-chip integration and reduced external components.
• Power and supply  Core supply range: 1.15 V to 1.25 V, designed for low-power operation to support thermally constrained and battery-powered applications.
• Package and mounting  780-BGA package (supplier device package: 780-FBGA, 29×29) intended for surface-mount PCB assembly.
• Operating grade and compliance  Commercial grade operation (0 °C to 85 °C) and RoHS compliant.

Typical Applications

• High-density I/O bridging  Use the 535 I/Os and flexible I/O standard support to implement protocol bridging, interface conversion, and board-level glue logic.
• Embedded control and signal processing  Combine 39,600 logic elements and on-chip RAM to implement custom control, DSP pipelines, and embedded processing with family support for Nios II where applicable.
• Low-power portable and handheld systems  Cyclone III low-power characteristics make this device suitable for battery-powered equipment requiring reduced static power.
• Field-upgradable systems  Family-level support for remote system upgrades enables in-field design updates without replacing hardware.

Unique Advantages

• Well-balanced logic and memory: 39,600 logic elements combined with approximately 1.16 Mbits of embedded RAM let you implement substantial logic and buffering on a single device.
• High I/O capacity: 535 user I/Os reduce the need for external interface chips and simplify board-level routing for I/O-heavy designs.
• Flexible clocking: Four PLLs with multiple outputs and dynamic reconfiguration capabilities provide robust clock management for complex systems.
• Low-power platform: Designed on a TSMC low-power process and optimized for reduced static power to support thermally constrained and power-sensitive applications.
• Compact surface-mount package: 780-BGA (780-FBGA, 29×29) provides a high-pin-count solution in a compact footprint for space-constrained PCBs.
• Commercial-grade and RoHS compliant: Commercial temperature range (0 °C to 85 °C) with RoHS compliance for standard electronic product deployments.

Why Choose EP3C40F780C6N?

The EP3C40F780C6N positions itself as a mid-range Cyclone III FPGA that combines substantial programmable logic, on-chip RAM, and a high I/O count in a compact BGA package. It is suited for designers who need to consolidate logic, memory, and multiple interfaces into a single, low-power device while maintaining a commercial-grade operating envelope.

Choose this device for designs that require scalable logic and memory capacity, flexible clock and I/O options, and a compact form factor that reduces BOM complexity and board area. The Cyclone III family-level features further enable system-level integration and field upgradeability supported by established device toolflows.

Request a quote or submit an inquiry to get pricing and availability for EP3C40F780C6N and to discuss how this Cyclone III FPGA can fit into your next design.