EP3C40F780C8

The EP3C40F780C8 is an Intel Cyclone® III field programmable gate array (FPGA) in a 780-ball FBGA package (29×29). It combines a mid-range logic capacity with substantial embedded memory and high I/O count for cost-sensitive, low-power designs.

Built on the Cyclone III device family architecture, this device targets high-volume, low-power and cost-aware applications where integration, low static power, and flexible I/O and clock management are important design drivers.

Key Features

• Logic Capacity  39,600 logic elements provide the programmable fabric for implementing custom logic, control paths, and datapaths.
• Logic Array Blocks (LABs)  2,475 LABs for structured logic grouping and efficient synthesis of complex designs.
• On-chip Memory  Approximately 1.16 Mbits of embedded RAM to support FIFOs, buffers, and small-data storage close to logic.
• I/O Resources  535 user I/Os enable dense external interfacing for system peripherals, sensors, and high-pin-count interfaces.
• Clock Management  Family-level clock features include up to four phase-locked loops (PLLs) for flexible clock synthesis and distribution within the device.
• Power Supply  Core voltage range 1.15 V to 1.25 V; Cyclone III family optimizations target low static power for thermally constrained and battery-operated systems.
• Package & Mounting  780-ball FBGA (29×29) package, surface-mount for standard PCB assembly and compact system integration.
• Operating Temperature & Grade  Commercial grade with operating range 0 °C to 85 °C suitable for mainstream embedded and consumer applications.
• Compliance  RoHS compliant, meeting common environmental material requirements.

Typical Applications

• Consumer and Portable Electronics  Low static power and consolidated logic/memory make this device suitable for battery-powered products that require configurable functionality.
• Embedded Control & Industrial Automation  High I/O count and abundant logic elements support motor control, protocol bridging, and custom control logic in compact systems.
• Communications & Interface Bridging  Large I/O resources and on-chip memory enable protocol conversion, buffering, and glue logic for mid-range networking and connectivity applications.

Unique Advantages

• High Logic-to-Memory Balance:  39,600 logic elements paired with approximately 1.16 Mbits of embedded RAM lets you implement complex control and datapath functions with local memory buffering.
• Substantial I/O Density:  535 user I/Os reduce external bridge components and simplify board-level integration for multi-interface systems.
• Low-Power Family Design:  Built on TSMC low-power process technology and Cyclone III power-aware architecture to help meet tight power budgets.
• Flexible Clocking:  Family support for multiple PLLs enables sophisticated clock domain management without excessive external components.
• Compact, Surface-Mount Package:  780-FBGA (29×29) supports high-density PCB layouts while maintaining robust signal routing options.
• Regulatory-Friendly:  RoHS compliance simplifies use in consumer and commercial products targeting global markets.

Why Choose EP3C40F780C8?

The EP3C40F780C8 positions itself as a cost-effective, mid-density Cyclone III FPGA option for designs that require a balanced combination of programmable logic, on-chip memory, and a high number of I/Os within a low-power footprint. Its commercial-grade operating range and surface-mount 780-FBGA package make it well suited for compact embedded systems, consumer devices, and general-purpose control applications.

Choosing this device leverages the Cyclone III family’s low-power silicon optimizations and extensive clocking and I/O capabilities, providing a scalable platform for development and long-term product deployment supported by established device documentation.

Request a quote or submit an inquiry to receive pricing and availability for the EP3C40F780C8 and to discuss how it fits your next design.