EP3C40F780I7N

The EP3C40F780I7N is an Intel Cyclone® III field programmable gate array (FPGA) offered in a 780-ball FBGA (29 × 29) surface-mount package. It delivers 39,600 logic elements and approximately 1.16 Mbits of embedded memory, engineered for industrial-grade applications that require high I/O density and low-power operation.

Built on the Cyclone III device family architecture, this device is suited for cost- and power-sensitive designs where integration of logic, memory, and high channel counts is essential. The device family emphasizes low static power, system integration features and flexible clock management to support complex embedded and interface functions.

Key Features

• Logic Capacity  39,600 logic elements provide substantial programmable logic for mid-range FPGA designs.
• Embedded Memory  Approximately 1.16 Mbits of on-chip RAM for buffering, FIFOs, and small embedded storage blocks.
• I/O Density  535 user I/Os to support wide parallel interfaces and high-pin-count system peripherals.
• Power Supply  Core voltage range 1.15 V to 1.25 V for integration into low-voltage power domains.
• Industrial Temperature Grade  Rated for operation from −40°C to 100°C, meeting industrial thermal requirements.
• Package and Mounting  780-FBGA (29 × 29) surface-mount package for compact board-level integration.
• Low-Power Family Attributes  Cyclone III family is designed for low static power operation, enabling lower cooling requirements and extended battery life in portable or thermally-constrained systems.
• Clock Management  Family-level clock resources include multiple phase-locked loops (PLLs) for robust clocking and flexible frequency/phase control.
• I/O Standards & Signal Integrity  The Cyclone III family supports a wide set of I/O standards and features such as adjustable slew rates and on-chip termination calibration to improve signal integrity across process, voltage, and temperature.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

• Industrial Control  Motor control, sensor aggregation, and real-time signal processing where industrial temperature range and high I/O count are required.
• Communications Interfaces  Protocol bridging, multi‑lane data mux/demux, and custom I/O interfacing leveraging the device’s high I/O count and flexible clocking.
• Embedded Processing and Acceleration  Hardware acceleration blocks, custom peripheral glue-logic, and local data buffering using the device’s logic density and embedded RAM.
• High-Volume, Low-Power Systems  Cost- and power-sensitive products that benefit from the Cyclone III family’s low static power characteristics and system integration features.

Unique Advantages

• High Logic-to-Memory Ratio: 39,600 logic elements combined with approximately 1.16 Mbits of embedded RAM enables balanced compute and storage for mid-range designs.
• Extensive I/O Count: 535 I/Os reduce the need for external GPIO expanders and simplify board-level routing for complex interfaces.
• Industrial Reliability: Rated for −40°C to 100°C operation and supplied in a robust 780-FBGA package suitable for industrial environments.
• Low-Voltage Core: 1.15 V–1.25 V core supply supports modern low-voltage power architectures and helps lower overall system power.
• Family-Level System Features: Cyclone III family advantages such as multiple PLLs, support for a broad set of I/O standards, and on-chip termination calibration help streamline system design and signal integrity management.
• RoHS Compliance: Environmentally compliant manufacturing reduces regulatory risk for global deployment.

Why Choose EP3C40F780I7N?

The EP3C40F780I7N positions itself as a mid-range Cyclone III FPGA option that balances substantial programmable logic, embedded memory, and very high I/O count in a compact 780-FBGA package. Its industrial temperature rating and low-voltage core make it appropriate for designs that must operate reliably across a wide thermal range while conserving board space and power.

Design teams seeking an FPGA platform with family-level features—such as flexible clock management, broad I/O standard support, and low static power—will find the EP3C40F780I7N suited for a range of embedded, industrial, and communications interface roles. Its combination of integration and compliance supports both prototyping and high-volume deployment scenarios.

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