EP3C40Q240C8N

IC FPGA 128 I/O 240QFP
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 128 1161216 39600 240-BFQFP

Quantity 502 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 85°C
Package / Case240-BFQFPNumber of I/O128Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2475Number of Logic Elements/Cells39600
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1161216

Overview of EP3C40Q240C8N – Cyclone® III Field Programmable Gate Array (FPGA) IC 128 1161216 39600 240-BFQFP

The EP3C40Q240C8N is an Intel Cyclone® III FPGA in a 240-pin BFQFP surface-mount package. It provides a mid-range density FPGA fabric with 39,600 logic elements and approximately 1.16 Mbits of embedded memory, designed for cost- and power-sensitive commercial applications.

Targeted at system designers needing flexible, low-power programmable logic, this device combines significant on-chip memory and I/O capacity with a low-voltage core supply (1.15 V to 1.25 V) and commercial temperature rating (0 °C to 85 °C).

Key Features

  • Logic Capacity — 39,600 logic elements implemented across 2,475 logic blocks to support medium-complexity HDL designs and custom logic integration.
  • Embedded Memory — Total on-chip RAM of 1,161,216 bits, or approximately 1.16 Mbits, for buffers, FIFOs, and state storage.
  • I/O Resources — 128 user I/Os to interface with peripherals, sensors, and external logic.
  • Clock Management — Cyclone III family architecture includes multiple phase-locked loops (PLLs) for flexible clock synthesis and distribution.
  • Low-Voltage Core — Core supply range of 1.15 V to 1.25 V supports low-power system designs.
  • Package & Mounting — 240-BFQFP (supplier package 240-PQFP, 32×32) in a surface-mount form factor for PCB assembly.
  • Commercial Grade — Rated for operation from 0 °C to 85 °C for standard commercial applications.
  • RoHS Compliant — Environmentally compliant with RoHS requirements.

Typical Applications

  • Embedded Control — Implement custom control logic, state machines, and glue logic for consumer and industrial equipment within a commercial temperature range.
  • High-Speed Interfaces — Use the device's 128 I/Os and clock-management resources to implement parallel or serialized interfaces and bridge functions.
  • Signal Processing — Leverage the 39,600 logic elements and on-chip memory for moderate-density signal processing, buffering, and packet handling tasks.
  • Prototyping & Custom ASIC Replacement — Flexible FPGA fabric for iterative development, feature upgrades, and reducing time-to-market for custom digital logic.

Unique Advantages

  • Balanced Logic and Memory: 39,600 logic elements paired with ~1.16 Mbits of embedded RAM deliver a strong mix of combinational and storage resources for mid-range designs.
  • Generous I/O Count: 128 user I/Os simplify system integration and reduce the need for additional interface components.
  • Low-Voltage Operation: 1.15 V–1.25 V core supply supports low-power system architectures and efficient power budgeting.
  • Compact Surface-Mount Package: 240-pin BFQFP (240-PQFP 32×32) enables high-density PCB layouts while remaining compatible with standard SMT assembly.
  • Commercial Temperature Rating: Specified 0 °C–85 °C operation aligns with a wide range of consumer and commercial product environments.
  • RoHS Compliance: Environmentally compliant manufacturing and disposal considerations met out of the box.

Why Choose EP3C40Q240C8N?

The EP3C40Q240C8N positions itself as a cost- and power-conscious Cyclone III FPGA option for designers who need substantial programmable logic, embedded memory, and plentiful I/O without moving to higher-density or specialized variants. Its low-voltage core and family-level low-power optimizations make it suitable for applications where power efficiency and integration matter.

This device is well suited to engineering teams building commercial-grade embedded systems, interface bridges, mid-complexity signal processing paths, and prototype platforms that benefit from the Cyclone III architecture and its clock-management features.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for EP3C40Q240C8N.

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