EP3C40Q240C8N
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 128 1161216 39600 240-BFQFP |
|---|---|
| Quantity | 502 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 240-PQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP | Number of I/O | 128 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2475 | Number of Logic Elements/Cells | 39600 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1161216 |
Overview of EP3C40Q240C8N – Cyclone® III Field Programmable Gate Array (FPGA) IC 128 1161216 39600 240-BFQFP
The EP3C40Q240C8N is an Intel Cyclone® III FPGA in a 240-pin BFQFP surface-mount package. It provides a mid-range density FPGA fabric with 39,600 logic elements and approximately 1.16 Mbits of embedded memory, designed for cost- and power-sensitive commercial applications.
Targeted at system designers needing flexible, low-power programmable logic, this device combines significant on-chip memory and I/O capacity with a low-voltage core supply (1.15 V to 1.25 V) and commercial temperature rating (0 °C to 85 °C).
Key Features
- Logic Capacity — 39,600 logic elements implemented across 2,475 logic blocks to support medium-complexity HDL designs and custom logic integration.
- Embedded Memory — Total on-chip RAM of 1,161,216 bits, or approximately 1.16 Mbits, for buffers, FIFOs, and state storage.
- I/O Resources — 128 user I/Os to interface with peripherals, sensors, and external logic.
- Clock Management — Cyclone III family architecture includes multiple phase-locked loops (PLLs) for flexible clock synthesis and distribution.
- Low-Voltage Core — Core supply range of 1.15 V to 1.25 V supports low-power system designs.
- Package & Mounting — 240-BFQFP (supplier package 240-PQFP, 32×32) in a surface-mount form factor for PCB assembly.
- Commercial Grade — Rated for operation from 0 °C to 85 °C for standard commercial applications.
- RoHS Compliant — Environmentally compliant with RoHS requirements.
Typical Applications
- Embedded Control — Implement custom control logic, state machines, and glue logic for consumer and industrial equipment within a commercial temperature range.
- High-Speed Interfaces — Use the device's 128 I/Os and clock-management resources to implement parallel or serialized interfaces and bridge functions.
- Signal Processing — Leverage the 39,600 logic elements and on-chip memory for moderate-density signal processing, buffering, and packet handling tasks.
- Prototyping & Custom ASIC Replacement — Flexible FPGA fabric for iterative development, feature upgrades, and reducing time-to-market for custom digital logic.
Unique Advantages
- Balanced Logic and Memory: 39,600 logic elements paired with ~1.16 Mbits of embedded RAM deliver a strong mix of combinational and storage resources for mid-range designs.
- Generous I/O Count: 128 user I/Os simplify system integration and reduce the need for additional interface components.
- Low-Voltage Operation: 1.15 V–1.25 V core supply supports low-power system architectures and efficient power budgeting.
- Compact Surface-Mount Package: 240-pin BFQFP (240-PQFP 32×32) enables high-density PCB layouts while remaining compatible with standard SMT assembly.
- Commercial Temperature Rating: Specified 0 °C–85 °C operation aligns with a wide range of consumer and commercial product environments.
- RoHS Compliance: Environmentally compliant manufacturing and disposal considerations met out of the box.
Why Choose EP3C40Q240C8N?
The EP3C40Q240C8N positions itself as a cost- and power-conscious Cyclone III FPGA option for designers who need substantial programmable logic, embedded memory, and plentiful I/O without moving to higher-density or specialized variants. Its low-voltage core and family-level low-power optimizations make it suitable for applications where power efficiency and integration matter.
This device is well suited to engineering teams building commercial-grade embedded systems, interface bridges, mid-complexity signal processing paths, and prototype platforms that benefit from the Cyclone III architecture and its clock-management features.
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