EP3C40U484A7N

The EP3C40U484A7N is a Cyclone III family FPGA offering reconfigurable logic in a 484‑ball FBGA package. It delivers 39,600 logic elements, approximately 1.16 Mbits of embedded memory, and 331 general‑purpose I/Os, making it suitable for designs that require medium-density programmable logic with significant on‑chip RAM and I/O capacity.

Built to Cyclone III device family design principles, this device targets low‑power, highly integrated applications and is qualified to AEC‑Q100 for automotive use, with an operating range from -40°C to 125°C and a core supply of 1.15–1.25 V.

Key Features

• Logic Capacity — 39,600 logic elements for implementing medium-density custom logic, control paths, and datapath functions.
• Embedded Memory — Approximately 1.16 Mbits of on‑chip RAM to support buffering, FIFOs, and small on‑chip datasets without external memory.
• I/O Count & Flexibility — 331 user I/Os to accommodate multiple peripherals, sensor interfaces, and board-level signals in I/O‑constrained designs.
• Power and Voltage — Core supply range of 1.15 V to 1.25 V, consistent with Cyclone III low‑power process characteristics described in the device handbook.
• System Integration (Cyclone III family) — Family features include low‑power silicon optimizations, on‑chip PLLs for clock management, and a high memory‑to‑logic ratio for integrated system functions.
• Automotive Qualification & Temperature Range — AEC‑Q100 qualification and an operating temperature range of -40°C to 125°C for automotive‑grade deployments.
• Package — 484‑FBGA (supplier package 484‑UBGA, 19×19) surface‑mount package for compact PCB footprints.
• Compliance — RoHS compliant.

Typical Applications

• Automotive Systems — Engine control, body electronics, or gateway functions where AEC‑Q100 qualification and wide operating temperature range are required.
• Embedded Control and Signal Automation — Real‑time control logic, sensor aggregation, and pre‑processing using on‑chip logic and embedded RAM to reduce external components.
• Instrumentation and Test Equipment — Medium‑density programmable logic for custom I/O handling, timing, and data buffering in test and measurement platforms.
• Portable and Thermally‑challenged Devices — Low‑power Cyclone III family traits help meet power budgets and enable operation in environments with limited cooling.

Unique Advantages

• Highly capable mid‑range logic: 39,600 logic elements provide the capacity to implement complex control and data‑path functions without moving to larger device families.
• On‑chip memory reduces BOM: Approximately 1.16 Mbits of embedded RAM supports buffering and local storage needs, reducing dependence on external memory.
• Large I/O count: 331 user I/Os simplify board routing for multi‑sensor and multi‑peripheral systems, minimizing additional I/O expanders.
• Automotive readiness: AEC‑Q100 qualification and -40°C to 125°C operation support deployment in automotive electronics and other demanding environments.
• Compact package: 484‑FBGA (19×19) delivers a small PCB footprint while preserving connectivity and thermal characteristics for dense board designs.
• Family ecosystem: Leveraging Cyclone III family capabilities (low‑power silicon optimizations, PLL‑based clock management, and a high memory‑to‑logic ratio) helps accelerate integration and system design.

Why Choose EP3C40U484A7N?

The EP3C40U484A7N positions itself as a mid‑density Cyclone III FPGA that balances logic capacity, embedded memory, and I/O count with automotive‑grade qualification. Its combination of 39,600 logic elements, roughly 1.16 Mbits of on‑chip RAM, 331 I/Os, and AEC‑Q100 qualification makes it appropriate for engineers designing robust, low‑power systems that require in‑field configurability and wide temperature operation.

Choose this device when you need a reprogrammable, integrated solution that reduces external components, supports a broad set of system interfaces, and meets automotive reliability requirements while maintaining a compact package footprint.

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