EP3C40U484C7N

The EP3C40U484C7N is a Cyclone® III field-programmable gate array (FPGA) delivering a balanced combination of integration, low power, and cost-efficiency. Built on the Cyclone III family architecture, this device targets high-volume, low-power, cost-sensitive applications that require substantial logic density, on-chip memory, and a high I/O count.

With 39,600 logic elements, approximately 1.16 Mbits of embedded memory, and 331 user I/Os in a compact 484-FBGA (19×19) package, the EP3C40U484C7N offers a scalable platform for control, interface, and signal-processing tasks while operating on a low-voltage supply (1.15–1.25 V) within commercial temperature ranges.

Key Features

• Logic Capacity  39,600 logic elements provide ample resources for medium-complexity logic integration and custom digital functions.
• On‑Chip Memory  Approximately 1.16 Mbits of embedded RAM supports buffering, packet processing, and local data storage without external memory.
• High I/O Count  331 user I/Os enable multiple parallel interfaces and board-level consolidation of peripheral connections.
• Low‑Voltage Operation  Nominal supply range of 1.15 V to 1.25 V reduces system power when integrated into low-power designs.
• Clocking and Timing  Cyclone III family architecture includes up to four phase-locked loops (PLLs) with multiple outputs for flexible clock management and synthesis.
• Package & Mounting  484-FBGA (supplier package 484-UBGA, 19×19) surface-mount package provides a compact footprint suitable for space-constrained PCBs.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation for general-purpose commercial applications.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.
• Family-Level Low Power  Cyclone III devices use TSMC low-power process technology and power-aware design flow to minimize static and dynamic power where applicable.

Typical Applications

• Portable and Handheld Equipment  Low-power Cyclone III architecture and compact 484-FBGA package make this device suitable for battery-conscious, space-limited portable designs.
• Interface Bridging and Protocol Conversion  High I/O count and flexible clocking support a range of parallel and serialized interfaces for bridging between subsystems.
• Embedded Control and Signal Processing  Logic capacity and on-chip RAM enable local processing, control state machines, and mid-range signal-processing tasks without external accelerators.
• Consumer and Communication Devices  Designed for high-volume, cost-sensitive consumer and communications products requiring balanced integration of logic, memory, and I/O.

Unique Advantages

• Highly integrated resources: 39,600 logic elements and approximately 1.16 Mbits of embedded memory reduce external component count and simplify board design.
• Flexible I/O provisioning: 331 user I/Os support extensive peripheral and interface consolidation, lowering system BOM and PCB routing complexity.
• Compact, surface-mount package: 484-FBGA (19×19) offers a dense footprint for space-constrained assemblies while maintaining signal routing density.
• Low-voltage operation: 1.15–1.25 V supply range contributes to overall system power reduction in low-power designs.
• Robust clock management: Family-level PLL resources deliver versatile clock synthesis and distribution to meet diverse timing requirements.
• Environmentally compliant: RoHS compliance supports regulatory and sustainability objectives.

Why Choose EP3C40U484C7N?

The EP3C40U484C7N combines mid-range logic density, on-chip memory, and a large I/O complement in a compact, low-voltage package—making it a practical choice for designers targeting cost-sensitive, low-power systems. Its Cyclone III family heritage brings architecture-level features such as low-power process technology and flexible clocking that help optimize system power and timing.

This FPGA is well suited for teams building portable devices, communication interfaces, or embedded control systems who need a balance of integration, predictable commercial-temperature operation, and a compact board-level footprint. Family support for design flows and pre-built IP (as available within the Cyclone III ecosystem) helps accelerate development and reduce time to market.

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