EP3C40U484C6

IC FPGA 331 I/O 484UBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 331 1161216 39600 484-FBGA

Quantity 638 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package484-UBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-FBGANumber of I/O331Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2475Number of Logic Elements/Cells39600
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1161216

Overview of EP3C40U484C6 – Cyclone III Field Programmable Gate Array, 484-FBGA

The EP3C40U484C6 is a commercial-grade Cyclone® III Field Programmable Gate Array (FPGA) in a 484-FBGA (484-UBGA, 19×19) surface-mount package. It delivers a balance of logic capacity, on-chip memory and I/O density targeted at high-volume, low-power and cost-sensitive applications.

Key silicon characteristics include 39,600 logic elements, approximately 1.16 Mbits of embedded memory and 331 user I/Os, while operating from a core supply of 1.15 V to 1.25 V and across a commercial temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

  • Logic Capacity  2475 CLB blocks delivering 39,600 logic elements for mid-range logic integration and combinatorial/sequential processing.
  • Embedded Memory  Approximately 1.16 Mbits of on-chip RAM to support buffering, FIFOs and local data storage without external memory.
  • I/O Density & Flexibility  331 user I/Os in a compact 484-FBGA package to support wide peripheral and interface requirements.
  • Low-Voltage Core  Core supply range of 1.15 V to 1.25 V to match system power rails and optimize power budgets.
  • Low Static Power  Cyclone III family optimizations target very low static power: device handbook notes static power consumption below 0.25 W for typical Cyclone III devices.
  • Clock Management  Cyclone III architecture provides multiple PLL resources (four PLLs per device in the family) for robust clock synthesis and distribution; PLLs are dynamically reconfigurable for runtime frequency/phase adjustments.
  • I/O Standard Support  Family-level support for a broad set of I/O standards including LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X, LVPECL, LVDS, mini-LVDS and BLVDS to simplify interface design.
  • Package & Mounting  484-FBGA (supplier package 484-UBGA, 19×19) surface-mount format balances PCB area and routing for high-density designs.
  • Commercial Temperature Grade  Specified for 0 °C to 85 °C operation for mainstream electronics applications.
  • Compliance  RoHS compliant for regulatory and manufacturing alignment.

Typical Applications

  • Portable & Handheld Devices  Low static power characteristics and efficient logic/memory balance make the part suitable for battery-conscious designs that require programmable logic.
  • High-Volume Consumer Electronics  Mid-range logic density and cost-sensitive Cyclone III family positioning suit consumer products and mass-produced embedded platforms.
  • Communications & I/O-Intensive Systems  High I/O count and wide I/O standard support enable protocol bridging, interface aggregation and front-end processing in networking or data-acquisition applications.
  • Embedded Processing & Custom Peripherals  On-chip memory, available PLLs and family-level support for soft processors and verified IP facilitate custom embedded functions and peripheral offload.

Unique Advantages

  • Balanced Logic and Memory:  39,600 logic elements and ~1.16 Mbits of embedded RAM let you implement complex state machines, accelerators and local buffering without immediate external memory.
  • High I/O Count in a Compact Package:  331 user I/Os in a 484-FBGA package enable dense connectivity while keeping PCB footprint manageable.
  • Low-Power Silicon:  Cyclone III family design and process choices target static power below 0.25 W, helping meet stringent power budgets in portable and thermally constrained systems.
  • Flexible Clocking:  Multiple, dynamically reconfigurable PLLs provide on-chip clock synthesis and distribution for complex timing domains and jitter management.
  • Wide I/O Standards Support:  Broad standard compatibility reduces the need for external level shifters or translators and simplifies board-level integration.
  • Commercial Temperature Suitability:  Rated 0 °C to 85 °C to match mainstream electronics operating environments.

Why Choose EP3C40U484C6?

The EP3C40U484C6 positions itself as a mid-range Cyclone III FPGA option that combines substantial logic capacity, meaningful embedded memory and a large I/O complement in a compact surface-mount FBGA package. It is aimed at designers and OEMs delivering cost-sensitive, low-power products that need programmable logic alongside flexible I/O and clocking resources.

As a member of the Cyclone III family, the device benefits from the family’s low-power silicon, available on-device clock management and a collection of pre-built IP and software tools that support faster design implementation and system integration.

Request a quote or submit a pricing inquiry to get started with EP3C40U484C6 for your next design.

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