EP3C40U484C6
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 331 1161216 39600 484-FBGA |
|---|---|
| Quantity | 638 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-UBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-FBGA | Number of I/O | 331 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2475 | Number of Logic Elements/Cells | 39600 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1161216 |
Overview of EP3C40U484C6 – Cyclone III Field Programmable Gate Array, 484-FBGA
The EP3C40U484C6 is a commercial-grade Cyclone® III Field Programmable Gate Array (FPGA) in a 484-FBGA (484-UBGA, 19×19) surface-mount package. It delivers a balance of logic capacity, on-chip memory and I/O density targeted at high-volume, low-power and cost-sensitive applications.
Key silicon characteristics include 39,600 logic elements, approximately 1.16 Mbits of embedded memory and 331 user I/Os, while operating from a core supply of 1.15 V to 1.25 V and across a commercial temperature range of 0 °C to 85 °C. The device is RoHS compliant.
Key Features
- Logic Capacity 2475 CLB blocks delivering 39,600 logic elements for mid-range logic integration and combinatorial/sequential processing.
- Embedded Memory Approximately 1.16 Mbits of on-chip RAM to support buffering, FIFOs and local data storage without external memory.
- I/O Density & Flexibility 331 user I/Os in a compact 484-FBGA package to support wide peripheral and interface requirements.
- Low-Voltage Core Core supply range of 1.15 V to 1.25 V to match system power rails and optimize power budgets.
- Low Static Power Cyclone III family optimizations target very low static power: device handbook notes static power consumption below 0.25 W for typical Cyclone III devices.
- Clock Management Cyclone III architecture provides multiple PLL resources (four PLLs per device in the family) for robust clock synthesis and distribution; PLLs are dynamically reconfigurable for runtime frequency/phase adjustments.
- I/O Standard Support Family-level support for a broad set of I/O standards including LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X, LVPECL, LVDS, mini-LVDS and BLVDS to simplify interface design.
- Package & Mounting 484-FBGA (supplier package 484-UBGA, 19×19) surface-mount format balances PCB area and routing for high-density designs.
- Commercial Temperature Grade Specified for 0 °C to 85 °C operation for mainstream electronics applications.
- Compliance RoHS compliant for regulatory and manufacturing alignment.
Typical Applications
- Portable & Handheld Devices Low static power characteristics and efficient logic/memory balance make the part suitable for battery-conscious designs that require programmable logic.
- High-Volume Consumer Electronics Mid-range logic density and cost-sensitive Cyclone III family positioning suit consumer products and mass-produced embedded platforms.
- Communications & I/O-Intensive Systems High I/O count and wide I/O standard support enable protocol bridging, interface aggregation and front-end processing in networking or data-acquisition applications.
- Embedded Processing & Custom Peripherals On-chip memory, available PLLs and family-level support for soft processors and verified IP facilitate custom embedded functions and peripheral offload.
Unique Advantages
- Balanced Logic and Memory: 39,600 logic elements and ~1.16 Mbits of embedded RAM let you implement complex state machines, accelerators and local buffering without immediate external memory.
- High I/O Count in a Compact Package: 331 user I/Os in a 484-FBGA package enable dense connectivity while keeping PCB footprint manageable.
- Low-Power Silicon: Cyclone III family design and process choices target static power below 0.25 W, helping meet stringent power budgets in portable and thermally constrained systems.
- Flexible Clocking: Multiple, dynamically reconfigurable PLLs provide on-chip clock synthesis and distribution for complex timing domains and jitter management.
- Wide I/O Standards Support: Broad standard compatibility reduces the need for external level shifters or translators and simplifies board-level integration.
- Commercial Temperature Suitability: Rated 0 °C to 85 °C to match mainstream electronics operating environments.
Why Choose EP3C40U484C6?
The EP3C40U484C6 positions itself as a mid-range Cyclone III FPGA option that combines substantial logic capacity, meaningful embedded memory and a large I/O complement in a compact surface-mount FBGA package. It is aimed at designers and OEMs delivering cost-sensitive, low-power products that need programmable logic alongside flexible I/O and clocking resources.
As a member of the Cyclone III family, the device benefits from the family’s low-power silicon, available on-device clock management and a collection of pre-built IP and software tools that support faster design implementation and system integration.
Request a quote or submit a pricing inquiry to get started with EP3C40U484C6 for your next design.

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