EP3C40U484C8

The EP3C40U484C8 is an Intel Cyclone® III FPGA in a 484‑FBGA surface‑mount package, offering a mid‑range FPGA resource set for commercial applications. The device provides 39,600 logic elements, approximately 1.16 Mbits of embedded memory, and 331 user I/Os, delivered with a 1.15 V to 1.25 V core supply and a 0 °C to 85 °C operating range.

As a member of the Cyclone III family, this device targets cost‑ and power‑sensitive designs that require a balance of integration and low static power consumption, while leveraging family features such as low‑power process optimizations and on‑chip clock management.

Key Features

• Core density  39,600 logic elements provide a mid‑range fabric suitable for complex glue logic, protocol bridging, and moderate compute acceleration.
• Embedded memory  Approximately 1.16 Mbits of on‑chip RAM to support buffering, FIFOs, and small memory‑intensive functions without external RAM.
• I/O capacity  331 user I/Os accommodate multiple parallel interfaces, sensor arrays, and multi‑lane peripheral connections in a single device.
• Power and process  Based on Cyclone III low‑power device family characteristics and a 1.15 V–1.25 V core supply, optimized for low static power in cost‑sensitive applications.
• Clock management  Cyclone III family devices include multiple PLLs for robust on‑chip clock synthesis and phase/frequency control to support diverse interface timing requirements.
• Package and mounting  484‑FBGA (supplier package 484‑UBGA, 19×19) in a surface‑mount form factor for compact PCB implementations.
• Commercial grade  Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial applications.

Typical Applications

• Portable and handheld devices  Low‑power Cyclone III characteristics enable extended battery life and reduced cooling needs for portable systems.
• Communications and interface bridging  High I/O count and on‑chip PLLs support multi‑lane interfaces and protocol conversion in networking and I/O‑intensive modules.
• Embedded control and signal conditioning  The combination of logic density and embedded RAM supports real‑time control, buffering, and data preprocessing in embedded systems.

Unique Advantages

• Balanced logic and memory  39,600 logic elements paired with approximately 1.16 Mbits of embedded memory provide a well‑matched fabric for combined control and data‑path functions.
• High I/O count  331 user I/Os reduce the need for external multiplexers or I/O expanders, simplifying board design and lowering BOM cost.
• Low‑power family design  Cyclone III family optimizations and the specified core voltage window enable designs that meet tight power budgets for cost‑sensitive products.
• Compact packaging  The 484‑FBGA (19×19 UBGA footprint) supports high‑density integration on space‑constrained PCBs.
• Commercial availability and compliance  Commercial temperature grade and RoHS compliance support mainstream manufacturing and regulatory requirements.
• On‑chip clock and IP support  Family features such as multiple PLLs and a broad set of pre‑built IP cores (Cyclone III family) accelerate development and integration.

Why Choose EP3C40U484C8?

EP3C40U484C8 provides a practical combination of logic density, embedded memory, and I/O resources in a compact 484‑FBGA package for commercial embedded designs. Its placement in the Cyclone III family brings low‑power process optimizations and on‑chip clock management that help designers meet power and integration targets without unnecessary overhead.

This device suits customers building cost‑sensitive, medium‑complexity systems that require flexible I/O, local memory for buffering, and reliable commercial‑grade operation, while benefiting from Cyclone III family IP and design flows to shorten development time.

Request a quote or submit an RFQ to check pricing, availability, and lead time for EP3C40U484C8.