EP3C55F484C6

The EP3C55F484C6 is an Intel Cyclone® III family Field Programmable Gate Array (FPGA) in a 484-ball fine-pitch BGA package. It integrates 55,856 logic elements, approximately 2.4 Mbits of embedded memory, and 327 user I/Os, delivering a balance of logic capacity, on-chip memory, and I/O for cost-sensitive, low-power applications.

Built on the Cyclone III device architecture, this device targets high-volume and power-conscious designs where integration and predictable power/thermal behavior matter. The device operates from a 1.15 V to 1.25 V supply and is specified for commercial temperature operation (0 °C to 85 °C).

Key Features

• Core – Logic Capacity 55,856 logic elements provide substantial programmable logic for mid-range FPGA designs and complex control or glue logic implementations.
• Embedded Memory Approximately 2.4 Mbits of on-chip RAM to store buffers, lookup tables, and state data without external memory.
• I/O Connectivity 327 user I/Os to support multiple interfaces and peripheral connections from a single device.
• Low-Voltage Operation 1.15 V to 1.25 V core supply range to align with the Cyclone III low-power design goals and system power budgets.
• Clocking and Timing Cyclone III family clock management features include up to four PLLs per device for flexible clock synthesis and distribution.
• Package and Mounting 484-ball FBGA (23 × 23) surface-mount package for compact integration on PCBs where board space and routing density matter.
• Operating Grade Commercial grade, specified for 0 °C to 85 °C operation.
• RoHS Compliant Meets RoHS environmental requirements for lead-free assembly.

Typical Applications

• Portable and Handheld Devices Low-power Cyclone III architecture and compact FBGA packaging help extend battery life and reduce cooling demands in portable systems.
• Consumer and High-Volume Electronics Mid-range logic and memory density suited to cost-sensitive, high-volume products that require programmable logic for feature differentiation.
• I/O-Intensive Systems High I/O count enables direct interfacing to multiple peripherals, sensors, and bus systems without extensive external glue logic.
• Thermally Constrained Designs Low static power characteristics of the Cyclone III family reduce cooling needs in compact or thermally-challenged enclosures.

Unique Advantages

• High Logic Integration: 55,856 logic elements allow consolidation of multiple functions into a single FPGA, reducing BOM and board complexity.
• On-Chip Memory: Approximately 2.4 Mbits of embedded RAM supports buffering and local data storage, minimizing external memory requirements.
• Extensive I/O: 327 user I/Os reduce the need for external I/O expanders and simplify system-level routing.
• Predictable Power Envelope: Narrow core-voltage range and Cyclone III low-power design approach aid in power budgeting and thermal planning.
• Compact Surface-Mount Package: 484-FBGA (23×23) enables high-density PCB layouts while maintaining robust signal routing.
• Commercial Temperature Rating: Specified 0 °C to 85 °C operation for mainstream electronics and consumer applications.

Why Choose EP3C55F484C6?

The EP3C55F484C6 combines mid-to-high logic density, on-chip memory, and a large I/O complement in a compact 484-FBGA package, making it well suited for designers who need programmable integration without excessive power or board area penalties. Its Cyclone III family heritage emphasizes low-power operation and system-level clock management, providing a practical balance between capability and efficiency.

This device is appropriate for engineering teams developing cost-sensitive, high-volume consumer and portable systems that require flexible logic, significant I/O, and predictable power and thermal behavior within a commercial temperature range.

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