EP3C55F484C7N

The EP3C55F484C7N is a Cyclone III family FPGA device offering a balance of mid-range logic density and on-chip memory in a 484-ball BGA package. It targets high-volume, low-power and cost-sensitive designs that require substantial programmable logic, embedded memory, and a high I/O count.

As part of the Cyclone III family, the device benefits from family-level attributes such as low-power process technology and device-level system integration features suited to embedded processing, interface bridging, and general-purpose programmable logic tasks.

Key Features

• Logic Capacity  55,856 logic elements for implementing complex combinational and sequential logic functions.
• Embedded Memory  Approximately 2.4 Mbits of on-chip RAM to support buffering, lookup tables, and small data stores without external memory.
• I/O Density  327 user I/O pins to support multiple parallel interfaces and I/O-heavy designs.
• Power Supply  Core operating voltage range of 1.15 V to 1.25 V, aligning with low-power design requirements.
• Package and Mounting  484-ball FBGA (23 × 23) package in surface-mount format for compact PCB integration.
• Operating Conditions  Commercial grade with an operating temperature range of 0 °C to 85 °C, suitable for mainstream electronics applications.
• RoHS Compliance  RoHS compliant for environmental and regulatory conformity.
• Cyclone III Family Capabilities  Family-level features include TSMC low-power process optimizations, multiple PLLs for clock management, and available design security features in Cyclone III LS variants.

Typical Applications

• Portable and Handheld Devices  Low core voltage and family low-power optimizations help extend battery life in portable designs that require programmable logic.
• Embedded Control and Signal Processing  Logic density and on-chip RAM enable custom control logic, real-time processing, and data buffering without immediate dependence on external memory.
• Communications and Interface Bridging  High I/O count supports multiple parallel interfaces, protocol bridging, and front-end logic for networking equipment and interface modules.
• Consumer and Industrial Electronics (Commercial Grade)  Flexible I/O and compact BGA packaging make the device suitable for a wide range of commercial electronics that require programmable logic and integration.

Unique Advantages

• High Logic Integration:  55,856 logic elements provide capacity for sizable custom logic implementations, reducing the need for multiple discrete devices.
• On-Chip Memory:  Approximately 2.4 Mbits of embedded RAM reduces external memory dependency and simplifies board design for buffering and LUT-based functions.
• Broad I/O Support:  327 I/Os enable multi-channel and parallel interface designs, minimizing external interface components.
• Compact Surface-Mount BGA:  484-FBGA (23 × 23) delivers a space-efficient footprint for dense PCB layouts and high pin-count routing.
• Low-Voltage Operation:  1.15 V to 1.25 V core supply supports low-power system design strategies.
• Regulatory and Environmental Compliance:  RoHS compliance supports environmentally conscious product design and manufacturing.

Why Choose EP3C55F484C7N?

The EP3C55F484C7N brings together substantial logic resources, meaningful on-chip memory, and a high I/O count in a compact 484-BGA package, making it a practical choice for designers building cost- and power-sensitive programmable logic solutions. Its placement within the Cyclone III family provides access to low-power silicon optimizations and family-level system features that simplify clock management and integration.

This device is well-suited for teams designing commercial electronics that need scalable programmable logic, on-chip buffering, and extensive I/O without increasing board area or component count. The combination of commercial temperature rating and RoHS compliance supports reliable deployment in mainstream product lines.

Request a quote or submit a purchase inquiry to evaluate EP3C55F484C7N for your next design.