EP3C55F484I7

The EP3C55F484I7 is a Cyclone® III family Field Programmable Gate Array (FPGA) in a 484-ball BGA package designed for industrial applications. It combines a high logic element count with on-chip embedded memory and a high I/O count to address cost- and power-sensitive designs that require flexible, reprogrammable logic.

As a member of the Cyclone III device family, the device benefits from low-power process optimizations and system-focused features such as integrated clock management and broad I/O support, making it suitable for applications where integration, efficiency, and temperature robustness matter.

Key Features

• Logic Density — 55,856 logic elements provide substantial programmable logic resource for complex control, glue-logic, or custom processing tasks.
• Embedded Memory — Approximately 2.4 Mbits of on-chip RAM to support FIFOs, buffers, and local data storage without external memory.
• I/O Capacity — 327 user I/Os support a wide range of system interfaces and parallel/serial connectivity needs.
• Package & Mounting — 484-BGA (supplier package: 484-FBGA 23×23) surface-mount package for dense PCB integration.
• Power Supply — Core voltage range of 1.15 V to 1.25 V to match system power rails and design constraints.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for reliable operation in industrial environments.
• Low-Power Family Characteristics — Cyclone III family is based on a low-power process and silicon/software optimizations to minimize power consumption for battery-operated or thermally constrained systems.
• Clock Management — Cyclone III family devices include multiple phase-locked loops (PLLs) for flexible clock synthesis and distribution in system designs.
• I/O Standards and Signal Integrity — Family-level support for a broad set of I/O standards (including LVTTL, LVCMOS, SSTL, HSTL, PCI/PCI‑X, PECL, LVDS and variants) and adjustable I/O slew rates to address diverse interface requirements.
• RoHS Compliant — Device meets RoHS requirements for environmentally compliant assemblies.

Typical Applications

• Industrial Control — Implement deterministic control logic, motor control interfaces, and real-time I/O aggregation within industrial systems operating across wide temperatures.
• Communications and Networking — Use the device’s high I/O count and embedded memory for protocol bridging, packet buffering, and custom interface logic.
• Embedded System Integration — Combine programmable logic and on-chip memory to offload tasks from microcontrollers or create custom accelerators in compact designs.
• Portable and Thermally-Challenged Devices — Leverage Cyclone III family low-power characteristics for battery-powered or thermally limited applications.

Unique Advantages

• High Logic Capacity: 55,856 logic elements enable complex state machines, glue logic, and moderate-scale custom processing without external programmable devices.
• On-Chip Memory: Approximately 2.4 Mbits of embedded RAM reduces dependence on external memory for buffering and local data storage, simplifying PCB design.
• Robust I/O Count: 327 user I/Os accommodate multi-channel interfaces and concurrent peripheral connections, minimizing the need for external multiplexing.
• Industrial Temperature Rating: −40 °C to 100 °C rating supports deployment in harsh and industrial environments.
• Compact BGA Package: 484-BGA (484-FBGA, 23×23) provides a dense footprint for space-constrained PCBs while maintaining connectivity.
• Family-Level Power and System Features: Benefits from Cyclone III low-power process and integrated clock management (PLLs) for efficient, synchronized system design.

Why Choose EP3C55F484I7?

EP3C55F484I7 positions itself as a practical, industrial-grade FPGA option for designers who need substantial programmable logic, embedded memory, and a high I/O count in a compact surface-mount package. Its operating voltage range and industrial temperature rating make it suitable for robust deployments where power and thermal budgets are important considerations.

By leveraging Cyclone III family features such as low-power operation, integrated clock management, and broad I/O standard support, this device offers a balanced combination of integration and flexibility for mid-range FPGA applications, helping reduce BOM complexity and enabling scalable hardware designs.

Request a quote today to check pricing and availability for EP3C55F484I7 and discuss how it can fit your next design.